EP4SGX180FF35C2XG

The EP4SGX180FF35C2XG is an Intel Stratix IV family Field Programmable Gate Array (FPGA) IC designed for high‑density, high‑function integration. It provides a large FPGA fabric with 175,750 logic elements and substantial embedded RAM to support complex logic, signal processing, and high‑throughput designs.

Built for commercial applications, this surface‑mount FCBGA device delivers broad I/O capacity and precise power rails, making it suitable for systems that require extensive programmable logic, on‑chip memory, and flexible I/O resources within a single package.

Key Features

• High‑capacity Logic  Provides 175,750 logic elements to implement large-scale digital designs and complex control or processing functions.
• Embedded Memory  Approximately 13.95 Mbits of on‑chip RAM to support large buffering, lookup tables, and memory‑intensive logic blocks.
• Extensive I/O  564 general I/O pins for broad external connectivity and interface flexibility.
• Power Supply Range  Operates from a core voltage supply of 870 mV to 930 mV, enabling stable core performance within the specified range.
• Package and Mounting  Available in a 1152‑FBGA supplier package (35×35) and listed as 1152‑BBGA / FCBGA package case; surface‑mount mounting type supports standard board assembly processes.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial applications.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.
• Stratix IV Family Features  Series documentation highlights architecture elements such as high‑speed transceivers, DSP blocks, PLLs, clock networks, and comprehensive I/O features suitable for high‑bandwidth and protocol‑rich designs.

Typical Applications

• High‑performance data processing  Large logic capacity and embedded memory enable complex data path and acceleration functions.
• Communications and networking  Family features such as high‑speed transceiver support and wide protocol coverage suit transport and switching applications that demand high aggregate bandwidth.
• External memory interface systems  Generous on‑chip RAM and I/O resources support designs that interface with off‑chip memories and peripherals.

Unique Advantages

• Large programmable fabric:  175,750 logic elements provide the headroom to consolidate multiple functions into a single device, reducing overall system complexity.
• Substantial embedded memory:  Approximately 13.95 Mbits of on‑chip RAM minimizes dependence on external memory for buffering and state storage.
• High I/O density:  564 I/O pins enable numerous parallel interfaces, sensor arrays, or bus connections without immediate need for external multiplexing.
• Controlled power envelope:  Defined core voltage range (870 mV–930 mV) supports stable operation within designed power rails.
• Standard surface‑mount FCBGA packaging:  1152‑FBGA (35×35) packaging supports high‑pin‑count board designs and conventional assembly flows.
• Commercial temperature qualification:  Rated 0 °C to 85 °C to match typical commercial product deployment environments.

Why Choose EP4SGX180FF35C2XG?

The EP4SGX180FF35C2XG combines a high logic element count, large embedded memory, and extensive I/O in a single Stratix IV family FPGA package. It is positioned for designs that require substantial programmable resources and on‑chip RAM to implement complex logic, high‑throughput data paths, and multiple interfaces while keeping system BOM and board real estate optimized.

This device is well suited to commercial systems engineers and procurement teams seeking a proven FPGA platform with family‑level features such as high‑speed transceivers, DSP capabilities, and mature clocking resources documented in the Stratix IV handbook. Its commercial grade and RoHS compliance support standard production and regulatory expectations.

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