EP4SGX180FF35C3

The EP4SGX180FF35C3 is a Stratix IV GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35). This commercial-grade FPGA provides a programmable logic platform with significant logic density, embedded memory, and a large user I/O count for complex digital implementations.

Key on-chip resources include 175,750 logic elements, approximately 14 Mbits of embedded memory, and 564 I/O pins, making this device suitable for designs that require extensive programmable logic and high I/O capacity within a surface-mount BGA footprint.

Key Features

• FPGA Architecture Stratix IV GX field programmable gate array IC—programmable digital logic in a single device.
• Logic Capacity 175,750 logic elements to implement complex custom digital functions.
• Embedded Memory Approximately 14 Mbits of on-chip RAM (13,954,048 total RAM bits) for buffering and on-chip storage.
• High I/O Count 564 user I/O pins to support multi-channel interfaces and parallel connectivity.
• Package & Mounting 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for compact board integration.
• Power Supply Supported core voltage range of 870 mV to 930 mV.
• Operating Range & Grade Commercial temperature range of 0 °C to 85 °C; commercial grade device.
• Environmental Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-density digital systems Implement complex logic functions and state machines using the device’s 175,750 logic elements.
• Memory-driven designs Leverage approximately 14 Mbits of embedded RAM for data buffering, lookup tables, and intermediate storage.
• High I/O, multi-channel interfaces Use the 564 I/O pins to connect multiple external peripherals, sensors, or parallel buses within a compact BGA footprint.
• Compact board integration Surface-mount 1152-FBGA (35×35) package accommodates dense PCB layouts where board area is at a premium.

Unique Advantages

• Substantial programmable logic capacity: 175,750 logic elements enable large-scale custom logic implementations without immediate need for multiple devices.
• On-chip memory for local storage: Approximately 14 Mbits of embedded RAM reduces reliance on external memory and simplifies data-path design.
• Large I/O resource: 564 user I/O pins provide flexibility for multi-channel connectivity and parallel interface requirements.
• Space-efficient BGA package: 1152-FBGA (35×35) surface-mount package supports high pin-count designs in a compact footprint.
• Commercial suitability: Designed for designs operating within a 0 °C to 85 °C range and RoHS-compliant manufacturing.

Why Choose EP4SGX180FF35C3?

The EP4SGX180FF35C3 delivers a balance of logic capacity, embedded memory, and high I/O count in a compact 1152-FBGA package, making it a strong choice for commercial designs that require extensive programmable logic and dense connectivity. Its specified voltage range and commercial temperature rating provide clear integration parameters for system power and thermal planning.

This device is suited to engineering teams and procurement professionals looking for a Stratix IV GX FPGA option that combines sizable on-chip resources and a high-pin-count BGA package for integration into space-conscious, I/O-rich boards, while meeting RoHS environmental requirements.

Request a quote today to obtain pricing and availability for EP4SGX180FF35C3 and to discuss lead times and ordering options.