EP4SGX180FF35C4N

The EP4SGX180FF35C4N is an Intel Stratix IV GX field-programmable gate array in a 1152‑BBGA (35×35) package. It provides a high-capacity FPGA fabric from the Stratix IV family with on-chip memory and I/O density suited to data‑intensive embedded and communications designs.

As a Stratix IV GX device, the part is described in the Stratix IV device handbook with architecture features including high-speed transceiver capabilities, embedded memory, DSP blocks, and advanced I/O and clock resources. The device targets applications that require large logic capacity, substantial embedded RAM, and high I/O pin counts while operating within commercial temperature and voltage ranges.

Key Features

• Logic Capacity  175,750 logic elements, providing substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 14 Mbits of embedded memory (13,954,048 total RAM bits) for on-chip buffering and data storage.
• I/O Density  564 I/O pins to support a wide range of external interfaces and high pin-count system connections.
• Stratix IV GX Architecture  Part of the Stratix IV GX family — documented with features such as high-speed transceiver support, DSP blocks, and comprehensive FPGA fabric and I/O features in the device handbook.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplier device package listed as 1152‑FBGA (35×35); surface-mount mounting type.
• Power Supply  Core voltage supply range specified at 870 mV to 930 mV.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑bandwidth communications equipment  Leverages Stratix IV GX transceiver and I/O capabilities and high logic density for protocol handling and data aggregation.
• Signal processing and DSP systems  Large logic capacity and embedded memory support complex DSP algorithms and buffering.
• Embedded networking and switching  High I/O count and substantial on-chip RAM enable packet processing and interface aggregation.

Unique Advantages

• High logic capacity: 175,750 logic elements enable integration of large custom logic blocks and complex state machines on a single device.
• Significant on‑chip memory: Approximately 14 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Dense I/O: 564 I/O pins provide flexibility for connecting multiple peripherals, interfaces, and memory subsystems.
• Stratix IV GX feature set: Documented family features include high-speed transceiver support, DSP blocks, and comprehensive fabric and I/O resources useful for data‑intensive designs.
• Commercial deployment ready: Commercial-grade temperature range (0 °C to 85 °C) and RoHS compliance support a broad range of production applications.
• Compact, surface-mount packaging: 1152‑BBGA (35×35) package balances I/O density and board-level integration for space-constrained designs.

Why Choose EP4SGX180FF35C4N?

The EP4SGX180FF35C4N positions itself as a high-capacity Stratix IV GX FPGA with a combination of extensive logic resources, substantial embedded memory, and high I/O density in a compact 1152‑BBGA package. Its documented family features — including high-speed transceiver capability and DSP resources — make it suitable for designs that require on-chip integration of complex processing, interface handling, and buffering.

This device is appropriate for teams and projects that need scalable FPGA resources with commercial-grade operating conditions and RoHS compliance, backed by the Stratix IV device handbook documentation from the manufacturer.

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