EP4SGX180FF35I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA |
|---|---|
| Quantity | 166 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180FF35I4N – Stratix IV GX FPGA, 175,750 logic elements, 564 I/Os
The EP4SGX180FF35I4N is an Intel Stratix IV GX field-programmable gate array (FPGA) in a 1152-BBGA (35 × 35) FCBGA package, offered as an industrial-grade, surface-mount device. It combines a high-density logic fabric with extensive I/O and on-chip memory to address demanding digital signal processing and high-throughput interface tasks.
Part of the Stratix IV device family, the device incorporates architecture elements referenced in the Stratix IV handbook—such as high-speed transceiver capability, embedded memory, DSP resources, and rich clocking and PLL resources—targeting applications that require large logic capacity, wide I/O counts, and robust thermal/voltage operating ranges.
Key Features
- High-density logic fabric — 175,750 logic elements (cells) to implement complex custom logic, protocol engines, or compute pipelines.
- Embedded memory — approximately 13.95 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage for high-throughput designs.
- Extensive I/O — 564 I/O pins to support wide parallel interfaces, multiple high-speed links, and heterogeneous peripheral integration.
- Stratix IV GX architecture features — device family capabilities documented in the Stratix IV handbook include high-speed transceiver features, DSP blocks, PLLs, and flexible clock networks for timing-critical systems.
- Package and mounting — 1152-FBGA (35 × 35) FCBGA package, surface-mount for compact board-level integration.
- Industrial-grade operation — rated operating temperature range from −40 °C to 100 °C for deployment in industrial thermal environments.
- Low-voltage core supply — specified core voltage range of 870 mV to 930 mV to align with modern power-rail architectures.
- Standards and compliance — RoHS-compliant device for regulated manufacturing and electronics recycling requirements.
Typical Applications
- High-speed communications — Implement protocol engines and transceiver-based links using the Stratix IV GX architecture and the device's large I/O complement.
- Signal processing and DSP — Deploy packet processing, filtering, or custom DSP pipelines using the large logic capacity and embedded memory.
- High-throughput data interfaces — Bridge external memory interfaces and wide parallel buses, leveraging the device’s large on-chip RAM and extensive I/O.
- Instrumentation and test equipment — Create custom capture, analysis, and control logic in industrial environments using the extended temperature range and package form factor.
Unique Advantages
- High logic density: 175,750 logic elements enable complex, large-scale designs without external FPGA partitioning.
- Substantial embedded memory: Approximately 13.95 Mbits of on-chip RAM reduces dependence on external memory for buffering and local storage.
- Broad I/O capability: 564 I/Os provide flexibility for multi-channel connectivity, parallel interfaces, and mixed-signal peripherals.
- Industrial temperature range: −40 °C to 100 °C supports deployment in harsh or thermally variable environments.
- Compact package: 1152-FBGA (35 × 35) FCBGA enables high-density board designs while maintaining robust signal routing options.
- Documented Stratix IV family features: Architecture-level capabilities such as high-speed transceivers, DSP blocks, and PLL/clock networks support advanced timing and protocol implementations.
Why Choose EP4SGX180FF35I4N?
The EP4SGX180FF35I4N positions itself for designs that require a combination of large logic capacity, extensive I/O, and meaningful on-chip memory within an industrial-grade FPGA package. Its Stratix IV GX family attributes—cited in the device handbook—provide architecture-level features useful for high-bandwidth and timing-sensitive applications.
This device is well suited for engineering teams designing high-performance communications, signal-processing, and interface-intensive systems that benefit from high-density logic, significant embedded RAM, and a broad I/O footprint, all in a surface-mount FCBGA package with an industrial operating temperature range.
Request a quote or submit an inquiry to our sales team to discuss availability, volume pricing, and design support for the EP4SGX180FF35I4N.

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