EP4SGX180FF35I4N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA

Quantity 166 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180FF35I4N – Stratix IV GX FPGA, 175,750 logic elements, 564 I/Os

The EP4SGX180FF35I4N is an Intel Stratix IV GX field-programmable gate array (FPGA) in a 1152-BBGA (35 × 35) FCBGA package, offered as an industrial-grade, surface-mount device. It combines a high-density logic fabric with extensive I/O and on-chip memory to address demanding digital signal processing and high-throughput interface tasks.

Part of the Stratix IV device family, the device incorporates architecture elements referenced in the Stratix IV handbook—such as high-speed transceiver capability, embedded memory, DSP resources, and rich clocking and PLL resources—targeting applications that require large logic capacity, wide I/O counts, and robust thermal/voltage operating ranges.

Key Features

  • High-density logic fabric — 175,750 logic elements (cells) to implement complex custom logic, protocol engines, or compute pipelines.
  • Embedded memory — approximately 13.95 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage for high-throughput designs.
  • Extensive I/O — 564 I/O pins to support wide parallel interfaces, multiple high-speed links, and heterogeneous peripheral integration.
  • Stratix IV GX architecture features — device family capabilities documented in the Stratix IV handbook include high-speed transceiver features, DSP blocks, PLLs, and flexible clock networks for timing-critical systems.
  • Package and mounting — 1152-FBGA (35 × 35) FCBGA package, surface-mount for compact board-level integration.
  • Industrial-grade operation — rated operating temperature range from −40 °C to 100 °C for deployment in industrial thermal environments.
  • Low-voltage core supply — specified core voltage range of 870 mV to 930 mV to align with modern power-rail architectures.
  • Standards and compliance — RoHS-compliant device for regulated manufacturing and electronics recycling requirements.

Typical Applications

  • High-speed communications — Implement protocol engines and transceiver-based links using the Stratix IV GX architecture and the device's large I/O complement.
  • Signal processing and DSP — Deploy packet processing, filtering, or custom DSP pipelines using the large logic capacity and embedded memory.
  • High-throughput data interfaces — Bridge external memory interfaces and wide parallel buses, leveraging the device’s large on-chip RAM and extensive I/O.
  • Instrumentation and test equipment — Create custom capture, analysis, and control logic in industrial environments using the extended temperature range and package form factor.

Unique Advantages

  • High logic density: 175,750 logic elements enable complex, large-scale designs without external FPGA partitioning.
  • Substantial embedded memory: Approximately 13.95 Mbits of on-chip RAM reduces dependence on external memory for buffering and local storage.
  • Broad I/O capability: 564 I/Os provide flexibility for multi-channel connectivity, parallel interfaces, and mixed-signal peripherals.
  • Industrial temperature range: −40 °C to 100 °C supports deployment in harsh or thermally variable environments.
  • Compact package: 1152-FBGA (35 × 35) FCBGA enables high-density board designs while maintaining robust signal routing options.
  • Documented Stratix IV family features: Architecture-level capabilities such as high-speed transceivers, DSP blocks, and PLL/clock networks support advanced timing and protocol implementations.

Why Choose EP4SGX180FF35I4N?

The EP4SGX180FF35I4N positions itself for designs that require a combination of large logic capacity, extensive I/O, and meaningful on-chip memory within an industrial-grade FPGA package. Its Stratix IV GX family attributes—cited in the device handbook—provide architecture-level features useful for high-bandwidth and timing-sensitive applications.

This device is well suited for engineering teams designing high-performance communications, signal-processing, and interface-intensive systems that benefit from high-density logic, significant embedded RAM, and a broad I/O footprint, all in a surface-mount FCBGA package with an industrial operating temperature range.

Request a quote or submit an inquiry to our sales team to discuss availability, volume pricing, and design support for the EP4SGX180FF35I4N.

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