EP4SGX180HF35C4

The EP4SGX180HF35C4 is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152-FBGA (35×35) surface-mount package for commercial applications. The device combines a large logic fabric and embedded memory with the Stratix IV family’s architecture features—including support for high-speed transceivers, DSP capabilities, and rich I/O—to address high-bandwidth, system-level integration tasks.

With 175,750 logic elements and approximately 13.95 Mbits of on-chip RAM, this device targets designs that require extensive programmable logic, significant embedded memory, and dense I/O—such as communications, high-performance signal processing, and complex system integration applications.

Key Features

• Logic Capacity — 175,750 logic elements provide substantial programmable fabric for complex custom logic and control functions.
• Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support buffering, packet processing, and DSP data storage.
• I/O Density — 564 I/Os enable dense board-level connectivity for external interfaces and peripheral integration.
• Package & Mounting — 1152-FBGA (35×35) package in a surface-mount form factor to support high I/O counts in a compact footprint.
• Power and Supply — Core voltage supply range of 870 mV to 930 mV to match system power rails within the specified range.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial deployments.
• Architecture Features (Series) — Stratix IV family features called out in the device handbook include high-speed transceiver support, DSP blocks, flexible clock networks and PLLs, and external memory interface support.
• Compliance — RoHS compliant for environmental and manufacturability requirements.

Typical Applications

• High‑performance Communications — Dense I/O and Stratix IV family transceiver and bandwidth features suit multi‑lane packet processing, protocol bridging, and PHY/ MAC offload functions.
• Signal Processing and DSP — Large logic capacity and substantial embedded RAM enable FIR/IIR filters, baseband processing, and other compute-intensive DSP tasks.
• Video and Imaging Systems — High logic and memory resources support frame buffering, custom image pipelines, and parallel pixel processing.
• System Integration / Interface Concentration — 564 I/Os and the FBGA package allow consolidation of multiple peripheral interfaces and board-level glue logic into a single programmable device.

Unique Advantages

• High Logic Density: 175,750 logic elements give designers the headroom to implement complex state machines, datapaths, and custom accelerators without partitioning across multiple devices.
• Significant On‑chip RAM: Approximately 13.95 Mbits of embedded memory reduces dependence on external RAM for many buffering and temporary storage needs.
• Extensive I/O Count: 564 I/Os enable direct connection to numerous peripherals and multiple external memory or interface channels, simplifying board design.
• Compact FBGA Package: The 1152-FBGA (35×35) form factor balances high pin count with a manageable PCB footprint for dense system designs.
• Commercial Temperature Grade: Rated 0 °C to 85 °C for standard commercial deployments where temperature-controlled environments are typical.
• RoHS Compliant: Meets lead‑free manufacturing and environmental requirements for modern production flows.

Why Choose EP4SGX180HF35C4?

The EP4SGX180HF35C4 positions itself as a high-capacity Stratix IV GX FPGA option for designers who need a combination of large logic resources, substantial embedded memory, and a high I/O count in a compact FBGA package. Its architecture—aligned with the Stratix IV device handbook—supports high-speed transceiver use cases, DSP processing, flexible clocking, and external memory interfaces, enabling integration of complex subsystems onto a single device.

This device is well suited to engineering teams designing communications equipment, high-performance signal processing systems, and multi-interface control platforms that require scalability and a mature FPGA architecture backed by vendor documentation and device family features.

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