EP4SGX180HF35I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,068 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180HF35I3G – Field Programmable Gate Array (FPGA) IC
The EP4SGX180HF35I3G is an Intel Stratix IV series Field Programmable Gate Array (FPGA) IC designed for high‑density, high‑bandwidth system designs. The device integrates a large logic fabric, significant on‑chip memory, and extensive I/O to address applications that require complex signal processing, protocol support, and system integration.
With support documented in the Stratix IV device handbook, this industrial‑grade FPGA targets designs that demand substantial logic capacity, embedded memory, and high I/O count while operating across a broad temperature and voltage range.
Key Features
- Core Logic Approximately 175,750 logic elements provide a large programmable fabric for implementing complex custom logic and control functions.
- Embedded Memory Approximately 13.95 Mbits of on‑chip RAM for buffering, FIFOs, and storage for DSP and packet processing tasks.
- I/O Density 564 I/O pins support high‑pin‑count external interfacing and dense board connectivity for multi‑lane and multi‑port designs.
- High‑Speed Architecture Elements Device family documentation highlights high‑speed transceiver features, PLLs, and clock networks suited for designs requiring high aggregate data bandwidth and protocol support.
- Package and Mounting Available in a 1152‑FBGA (35×35) FCBGA package; surface‑mount construction supports standard PCB assembly flows.
- Power and Supply Core voltage supply range specified from 870 mV to 930 mV to match system power domains and vendor power sequencing guidance.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, enabling deployment in industrial and other temperature‑sensitive environments.
- Regulatory Status RoHS compliant.
Typical Applications
- High‑bandwidth communications Implement protocol handling and multi‑lane data aggregation where the device’s documented high aggregate data bandwidth and transceiver features are required.
- Digital signal processing Use the large logic fabric and approximately 13.95 Mbits of embedded memory for DSP pipelines, filtering, and data buffering.
- Network and telecom systems Leverage high I/O count and Stratix IV architecture elements to implement packet processing, interface bridging, and protocol conversion.
- System integration and prototyping Integrate custom control logic, external memory interfaces, and clocking structures for complex platform verification and integration tasks.
Unique Advantages
- Highly integrated programmable fabric: Approximately 175,750 logic elements combined with abundant on‑chip RAM reduce the need for external logic and memory in many designs.
- Designed for high data throughput: Device family features emphasize high‑speed transceivers, clock networks, and architecture elements that support large aggregate bandwidth and protocol diversity.
- High I/O capacity: 564 I/O pins enable dense external connectivity and multi‑port interfaces without complex multiplexing schemes.
- Industrial‑grade operation: Specified operation from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments.
- Compact, production‑ready package: 1152‑FBGA (35×35) surface‑mount package provides a compact footprint for high‑density boards while supporting standard assembly.
- Low‑voltage core operation: Core supply range of 870–930 mV aligns with modern low‑voltage system designs and power budgets.
Why Choose EP4SGX180HF35I3G?
The EP4SGX180HF35I3G offers a combination of large logic capacity, substantial embedded memory, and high I/O density within the Stratix IV device family, making it suitable for designs that require significant on‑chip resources and high aggregate data throughput. Its industrial temperature rating and RoHS compliance further support deployment in demanding environments.
Engineers and system designers who need a configurable platform for high‑performance signal processing, protocol handling, and system integration can rely on the documented Stratix IV architecture and device handbook to guide implementation and optimization.
If you would like pricing or availability, request a quote or submit a purchase inquiry to begin the procurement process for EP4SGX180HF35I3G.

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