EP4SGX180HF35I4G

The EP4SGX180HF35I4G is an Intel Stratix IV GX family Field Programmable Gate Array (FPGA) designed for high-density, high-performance system designs. It provides a large logic fabric, significant on-chip memory, and extensive I/O to support demanding data-path, protocol and integration requirements.

Targeted at industrial applications, this surface-mount FCBGA device combines logic capacity, embedded memory and a wide I/O count with an extended operating temperature range and low-voltage core supply to address robust, performance-oriented designs.

Key Features

• Logic Capacity — 175,750 logic elements to implement complex logic, state machines and custom datapaths.
• Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O Density — 564 user I/Os for broad peripheral connectivity and high pin-count interfaces.
• Package & Mounting — 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package for compact board integration.
• Power — Core voltage supply specified between 870 mV and 930 mV to match system power-rail requirements.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C for deployment in industrial environments.
• Family Architecture Highlights — Stratix IV device handbook features: high-speed transceiver capabilities, high aggregate data bandwidth, dedicated DSP blocks, PLLs and rich clock-network resources (series-level features from device handbook).
• Standards & Compliance — RoHS compliant.

Typical Applications

• High-speed communications and networking — Leverage the Stratix IV family’s high-speed transceiver and high aggregate bandwidth features for protocol bridging and data-path processing.
• Data acquisition and test equipment — Large logic capacity and on-chip memory enable real-time signal processing and buffering in measurement systems.
• Embedded compute and protocol acceleration — Implement custom accelerators, protocol handlers and hardware offload engines using abundant logic elements and DSP resources.
• Industrial systems — Industrial-grade temperature range and high I/O count support robust control, monitoring and I/O-concentrator roles.

Unique Advantages

• High logic density: 175,750 logic elements provide the headroom to implement complex, high-performance designs on a single device, reducing component count.
• Substantial embedded memory: Approximately 13.95 Mbits of on-chip RAM minimizes dependence on external memory for buffering and local data storage.
• Extensive I/O resources: 564 I/Os accommodate large peripheral sets and high-pin-count interfaces without additional multiplexing logic.
• Industrial-grade operation: Specified operation from −40°C to 100°C supports deployment in temperature-challenging industrial environments.
• Compact FCBGA packaging: 1152-ball FCBGA (35×35) surface-mount package enables dense board-level integration while supporting the device’s I/O and power requirements.
• Low-voltage core compatibility: Core supply range of 870–930 mV aligns with modern low-voltage power architectures for efficient system integration.

Why Choose EP4SGX180HF35I4G?

The EP4SGX180HF35I4G positions itself as a robust, high-capacity Stratix IV GX FPGA option for engineers who need extensive logic resources, significant on-chip memory and a high I/O count in an industrial-temperature device. Its combination of series-level Stratix IV features—such as high-speed transceiver capability, DSP support and rich clocking—make it suitable for demanding data-path, protocol and processing tasks.

This device is well suited to design teams building high-throughput communications, instrumentation, embedded acceleration or industrial control systems that require a proven FPGA architecture with strong integration potential and long-term availability backed by Intel’s device family documentation.

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