EP4SGX180HF35I4N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA |
|---|---|
| Quantity | 28 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 564 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180HF35I4N – Stratix IV GX FPGA, 175,750 logic elements, 1152‑FBGA (35×35)
The EP4SGX180HF35I4N is a Stratix® IV GX field programmable gate array (FPGA) from Intel. It integrates a large programmable fabric and series-level features from the Stratix IV GX family, including high-speed transceiver capabilities and a broad set of FPGA fabric resources.
Designed for demanding industrial applications, this device targets designs that require high logic capacity, substantial embedded memory, and extensive I/O connectivity while operating across a wide industrial temperature range.
Key Features
- Core Capacity — 175,750 logic elements and 7,030 CLBs provide substantial programmable logic resources for complex designs.
- Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
- I/O Density — 564 I/O pins to accommodate wide external interfacing, multi-channel connectivity, and parallel buses.
- Stratix IV GX Series Features — Series-level architecture includes high-speed transceiver support, DSP blocks, PLLs, clock networks, and external memory interface capabilities as described in the Stratix IV device handbook.
- Package and Mounting — 1152‑FBGA (35×35) package in a surface-mount form factor (listed as 1152-BBGA, FCBGA) for high‑density board implementations.
- Power — Core supply range specified from 870 mV to 930 mV.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial environments.
- Compliance — RoHS compliant.
Typical Applications
- High-speed serial and protocol bridging — Leverages Stratix IV GX transceiver features for designs that require protocol conversion and serial link aggregation.
- Signal processing and DSP — Large logic capacity and embedded memory support DSP pipelines and real-time data processing tasks.
- Memory interface controllers — On‑chip resources and external memory interface features enable memory controller and caching functions.
- I/O‑intensive systems — High I/O count supports multi-port interfaces, wide parallel buses, and rich peripheral connectivity.
Unique Advantages
- Large programmable fabric: 175,750 logic elements give room for complex algorithms, custom accelerators, and wide datapaths.
- Significant embedded memory: Approximately 13.95 Mbits of on‑chip RAM reduces external memory dependence for intermediate buffering and local storage.
- High I/O capacity: 564 I/Os enable extensive external interfacing and system partitioning without additional IO expanders.
- Designed for high-speed serial designs: Stratix IV GX series-level transceiver and protocol support (as documented in the device handbook) facilitate high-bandwidth connectivity.
- Industrial grade thermal range: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
- Compact, high-density package: 1152‑FBGA (35×35) surface-mount packaging offers a small footprint for high-performance boards.
Why Choose EP4SGX180HF35I4N?
The EP4SGX180HF35I4N positions itself as a high-capacity Stratix IV GX FPGA suitable for industrial systems that require a balance of large logic resources, on-chip memory, and extensive I/O in a compact package. Its specified core voltage range and industrial temperature rating make it applicable to robust embedded designs.
This device is appropriate for teams implementing complex signal processing, high‑bandwidth serial connectivity, or dense I/O interfacing who need the Series-level architecture and resources documented in the Stratix IV device handbook.
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