EP4SGX180KF40C3

The EP4SGX180KF40C3 is an Intel Stratix IV GX FPGA in a 1517-BBGA FCBGA package, offering a large FPGA fabric with 175,750 logic elements and approximately 13.95 Mbits of embedded memory. The device provides extensive I/O connectivity (744 I/Os) and a core supply voltage range of 870 mV to 930 mV, packaged for surface-mount assembly and specified for commercial temperature operation (0 °C to 85 °C).

Technical documentation for the Stratix IV family includes detailed DC and switching characteristics, transceiver and datapath performance, PLL and clock-tree specifications, DSP block details, and TriMatrix memory block specifications—useful references when integrating this device into complex digital designs.

Key Features

• Logic Capacity — 175,750 logic elements provide a large programmable fabric for complex digital functions and system-level integration.
• Logic Array Blocks (LABs) — 7,030 LABs for organized logic grouping and routing across the device.
• Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support buffering, packet processing, and memory-intensive logic.
• I/O — 744 I/O pins to support broad external connectivity and parallel interfaces.
• Package — 1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40) in a surface-mount form factor to support high-density board layouts.
• Power and Operating Conditions — Core voltage supply range of 870 mV to 930 mV; commercial grade operating temperature range of 0 °C to 85 °C.
• Device Documentation — Stratix IV device handbook and datasheet material cover DC/switching characteristics, transceiver specifications, PLL and clock-tree details, DSP block specifications, TriMatrix memory block specifications, and configuration/JTAG information.
• Compliance — RoHS compliant for regulatory alignment in standard commercial applications.

Typical Applications

• High-density digital processing — Use where large logic capacity and on-chip memory are required to implement complex algorithms and system functions.
• Multi‑interface systems — Deploy in designs that need numerous I/O lines for parallel buses, multi-channel data paths, or extensive peripheral connectivity.
• Memory‑intensive logic — Suitable for applications relying on substantial embedded RAM for buffering, FIFOs, or packet processing.

Unique Advantages

• High logic density: 175,750 logic elements enable integration of large functions and multiple subsystems on a single device, reducing external logic.
• Substantial on‑chip memory: Approximately 13.95 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O connectivity: 744 I/Os allow flexible interfacing to peripherals, data converters, and high-pin-count subsystems.
• Comprehensive device documentation: Stratix IV device handbook content covers key building blocks such as PLLs, DSP blocks, TriMatrix memory, and transceiver performance for engineering validation.
• Compact surface‑mount package: 1517-FBGA (40×40) packaging supports dense board designs while providing the pinout needed for complex applications.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance align with standard commercial product requirements.

Why Choose EP4SGX180KF40C3?

The EP4SGX180KF40C3 positions itself as a high-capacity Stratix IV GX FPGA option for designs that demand large programmable logic resources, abundant embedded memory, and wide I/O capability. Its documented device features—covering transceivers, DSP blocks, PLLs, and memory blocks—support thorough system-level design and validation.

This device is well suited to engineering teams and procurement groups targeting commercial-grade FPGA integration where on-chip resources can reduce external components, simplify board architecture, and consolidate multiple functions into a single programmable device.

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