EP4SGX180KF40C3N

IC FPGA 744 I/O 1517FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 13954048 175750 1517-BBGA, FCBGA

Quantity 607 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180KF40C3N – Stratix® IV GX FPGA, 175,750 logic elements, 744 I/O

The EP4SGX180KF40C3N is a Stratix IV GX Field Programmable Gate Array (FPGA) IC in a 1517-BBGA FCBGA package. It delivers a large programmable fabric with dedicated on-chip memory, DSP resources, and high-speed I/O capability geared for demanding digital designs.

Built for systems that require extensive logic density and high-bandwidth interfaces, this device targets high-performance applications that take advantage of Stratix IV GX architecture elements such as high-speed transceivers, embedded memory, and advanced I/O features.

Key Features

  • Programmable Logic Capacity — 175,750 logic elements provide a high-density fabric for complex digital designs and large-scale integration.
  • Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support large buffering, packet storage, and intermediate data processing.
  • High I/O Count — 744 I/O pins enable extensive external connectivity and support for wide parallel interfaces.
  • Stratix IV GX Architecture — Device family features referenced in the Stratix IV handbook, including architecture-level support for high-speed transceivers, signal integrity enhancements, and wide protocol support.
  • High-Speed Transceivers & Differential I/O — The series documentation highlights high-speed transceiver features and differential I/O capabilities intended for high-bandwidth serial links and external memory interfaces.
  • DSP and Clocking Resources — The device family includes digital signal processing (DSP) blocks and advanced clock networks with PLLs for precise timing and high-performance signal processing.
  • Power Supply — Core supply range specified at 870 mV to 930 mV for device operation.
  • Package & Mounting — 1517-BBGA FCBGA (1517-FBGA, 40×40) package, surface-mount mounting for PCB integration.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial systems.
  • RoHS Compliant — Device meets RoHS requirements for compliant assembly and manufacturing.

Typical Applications

  • High‑speed networking — Leverage high-speed transceiver features and wide protocol support for bandwidth‑intensive data paths and packet processing.
  • Signal processing and acceleration — Use abundant logic elements, DSP blocks, and embedded memory for real‑time processing and algorithm acceleration.
  • External memory interface controllers — Support for external memory interfaces using extensive I/O and on‑chip resources for buffering and timing control.
  • High-density integration — Consolidate multiple functions into a single FPGA leveraging the device’s large logic capacity and I/O count to reduce board-level complexity.

Unique Advantages

  • High logic density: 175,750 logic elements enable implementation of complex systems on a single device, reducing the need for multiple FPGAs.
  • Significant on‑chip memory: Approximately 13.95 Mbits of embedded RAM supports large buffers, frame storage, and state machines without immediate reliance on external memory.
  • Extensive I/O flexibility: 744 I/O pins provide broad connectivity options for parallel interfaces, memory buses, and peripheral integration.
  • Architectural support for high bandwidth: Stratix IV GX device family features include high-speed transceivers and differential I/O options to manage demanding data rates.
  • Commercial temperature operation: Rated 0 °C to 85 °C for deployment in commercial electronic systems.
  • Standards‑friendly manufacturing: RoHS compliance aids integration into modern, environmentally conscious production workflows.

Why Choose EP4SGX180KF40C3N?

The EP4SGX180KF40C3N combines a substantial logic fabric, sizeable embedded memory, and a large I/O complement within the Stratix IV GX family architecture. It is positioned for engineering teams that require scalable programmable logic with support for high-speed serial and parallel interfaces, on-chip DSP resources, and robust clocking options.

This device is suited to designs where integration density, on-chip memory capacity, and extensive connectivity reduce system complexity and enable compact, high-performance solutions. The documented Stratix IV feature set and commercial ratings make it a practical choice for demanding electronic systems within the specified operating conditions.

Request a quote or submit an inquiry to begin specifying the EP4SGX180KF40C3N for your next high-performance FPGA design.

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