EP4SGX180KF40C3N
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 13954048 175750 1517-BBGA, FCBGA |
|---|---|
| Quantity | 607 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7030 | Number of Logic Elements/Cells | 175750 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13954048 |
Overview of EP4SGX180KF40C3N – Stratix® IV GX FPGA, 175,750 logic elements, 744 I/O
The EP4SGX180KF40C3N is a Stratix IV GX Field Programmable Gate Array (FPGA) IC in a 1517-BBGA FCBGA package. It delivers a large programmable fabric with dedicated on-chip memory, DSP resources, and high-speed I/O capability geared for demanding digital designs.
Built for systems that require extensive logic density and high-bandwidth interfaces, this device targets high-performance applications that take advantage of Stratix IV GX architecture elements such as high-speed transceivers, embedded memory, and advanced I/O features.
Key Features
- Programmable Logic Capacity — 175,750 logic elements provide a high-density fabric for complex digital designs and large-scale integration.
- Embedded Memory — Approximately 13.95 Mbits of on-chip RAM to support large buffering, packet storage, and intermediate data processing.
- High I/O Count — 744 I/O pins enable extensive external connectivity and support for wide parallel interfaces.
- Stratix IV GX Architecture — Device family features referenced in the Stratix IV handbook, including architecture-level support for high-speed transceivers, signal integrity enhancements, and wide protocol support.
- High-Speed Transceivers & Differential I/O — The series documentation highlights high-speed transceiver features and differential I/O capabilities intended for high-bandwidth serial links and external memory interfaces.
- DSP and Clocking Resources — The device family includes digital signal processing (DSP) blocks and advanced clock networks with PLLs for precise timing and high-performance signal processing.
- Power Supply — Core supply range specified at 870 mV to 930 mV for device operation.
- Package & Mounting — 1517-BBGA FCBGA (1517-FBGA, 40×40) package, surface-mount mounting for PCB integration.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial systems.
- RoHS Compliant — Device meets RoHS requirements for compliant assembly and manufacturing.
Typical Applications
- High‑speed networking — Leverage high-speed transceiver features and wide protocol support for bandwidth‑intensive data paths and packet processing.
- Signal processing and acceleration — Use abundant logic elements, DSP blocks, and embedded memory for real‑time processing and algorithm acceleration.
- External memory interface controllers — Support for external memory interfaces using extensive I/O and on‑chip resources for buffering and timing control.
- High-density integration — Consolidate multiple functions into a single FPGA leveraging the device’s large logic capacity and I/O count to reduce board-level complexity.
Unique Advantages
- High logic density: 175,750 logic elements enable implementation of complex systems on a single device, reducing the need for multiple FPGAs.
- Significant on‑chip memory: Approximately 13.95 Mbits of embedded RAM supports large buffers, frame storage, and state machines without immediate reliance on external memory.
- Extensive I/O flexibility: 744 I/O pins provide broad connectivity options for parallel interfaces, memory buses, and peripheral integration.
- Architectural support for high bandwidth: Stratix IV GX device family features include high-speed transceivers and differential I/O options to manage demanding data rates.
- Commercial temperature operation: Rated 0 °C to 85 °C for deployment in commercial electronic systems.
- Standards‑friendly manufacturing: RoHS compliance aids integration into modern, environmentally conscious production workflows.
Why Choose EP4SGX180KF40C3N?
The EP4SGX180KF40C3N combines a substantial logic fabric, sizeable embedded memory, and a large I/O complement within the Stratix IV GX family architecture. It is positioned for engineering teams that require scalable programmable logic with support for high-speed serial and parallel interfaces, on-chip DSP resources, and robust clocking options.
This device is suited to designs where integration density, on-chip memory capacity, and extensive connectivity reduce system complexity and enable compact, high-performance solutions. The documented Stratix IV feature set and commercial ratings make it a practical choice for demanding electronic systems within the specified operating conditions.
Request a quote or submit an inquiry to begin specifying the EP4SGX180KF40C3N for your next high-performance FPGA design.

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