EP4SGX180HF35I4

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA

Quantity 133 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180HF35I4 – Stratix® IV GX Field Programmable Gate Array (FPGA)

The EP4SGX180HF35I4 is an industrial-grade Stratix IV GX FPGA in a 1152-BBGA (35×35 FCBGA) package optimized for high-density, high-channel-count designs. It provides a large programmable fabric with dedicated DSP resources, embedded memory, and high-speed transceiver capabilities as documented in the Stratix IV Device Handbook.

Designed for applications that demand substantial logic capacity, abundant I/O and on-chip memory, this device targets communications, signal processing and compute-accelerated system designs that require a robust industrial temperature range and compact surface-mount packaging.

Key Features

  • Logic Capacity — 175,750 logic elements to implement complex custom logic, state machines and datapath designs.
  • Embedded Memory — Approximately 13.95 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O Density — 564 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • High‑speed Transceiver and DSP Resources — Includes the Stratix IV series’ transceiver performance specifications and DSP block features as documented in the device handbook for high-throughput serial links and signal-processing tasks.
  • Power and Core Voltage — Specified operating core voltage range of 870 mV to 930 mV for consistent core operation.
  • Packaging and Mounting — 1152-BBGA, FCBGA (1152-FBGA, 35×35) surface-mount package for high-density board integration.
  • Industrial Temperature Range — Rated for operation from −40°C to 100°C for deployment in industrial environments.
  • Comprehensive Device Documentation — Device handbook sections cover DC and switching characteristics, PLLs, clock trees, configuration/JTAG, TriMatrix memory blocks and power consumption information for system design and validation.

Typical Applications

  • High‑performance Communications — Implements protocol offload, packet processing and transceiver-based line cards where extensive logic, embedded memory and transceiver features are required.
  • Signal Processing and Acceleration — Hosts DSP blocks and large logic arrays for FIR/IIR filters, FFT engines and custom acceleration of compute-intensive algorithms.
  • Data Acquisition and Instrumentation — Provides abundant I/O and embedded RAM for multi-channel data capture, preprocessing and buffering in instrumentation systems.
  • Industrial Controls and Automation — Supports complex motor control, real-time control loops and multi-interface bridging within the specified industrial temperature range.

Unique Advantages

  • High Logic Density: 175,750 logic elements enable large, integrated designs that reduce the need for multiple devices.
  • Substantial On‑chip Memory: Approximately 13.95 Mbits of embedded RAM supports deep buffering and local storage to minimize external memory bandwidth requirements.
  • Extensive I/O Count: 564 I/O pins allow flexible interface routing and high parallelism for system-level integration.
  • Industrial Qualification: Rated for −40°C to 100°C operation to meet demands of industrial deployments.
  • High‑density Packaging: 1152-BBGA (35×35 FCBGA) surface-mount package provides a compact footprint for space-constrained boards.
  • Detailed Technical Reference: Supported by the Stratix IV Device Handbook content covering power, timing, PLLs, DSP and transceiver specifications to aid system design and validation.

Why Choose EP4SGX180HF35I4?

The EP4SGX180HF35I4 offers a combination of high logic capacity, abundant embedded memory and large I/O count in an industrial-grade FCBGA package, making it suitable for complex communications, signal-processing and industrial control systems. Its documented transceiver and DSP resources provide the technical foundation needed to implement high-throughput serial links and computation-accelerated functions.

For teams building systems that require scalable programmable logic, robust documentation and a compact, high-density package, this Stratix IV GX device delivers the configuration density and on-chip resources necessary to consolidate functions and simplify board-level designs.

Request a quote or submit an inquiry to obtain pricing and availability for EP4SGX180HF35I4 and to discuss volume or design-support options.

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