EP4SGX180HF35I3N

IC FPGA 564 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 564 13954048 175750 1152-BBGA, FCBGA

Quantity 350 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O564Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7030Number of Logic Elements/Cells175750
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13954048

Overview of EP4SGX180HF35I3N – Stratix® IV GX FPGA, 564 I/O, 1152-BBGA (FCBGA)

The EP4SGX180HF35I3N is an Intel Stratix IV GX field-programmable gate array (FPGA) in a 1152-BBGA (FCBGA) package. It delivers a high-density programmable fabric combined with the Stratix IV family architecture features for demanding communication and signal-processing applications.

With 175,750 logic elements, approximately 14 Mbits of embedded memory, and 564 I/O pins, this industrial-grade device is positioned for designs that require significant logic capacity, substantial on-chip RAM, and extensive I/O connectivity. The Stratix IV device handbook lists family-level features such as high-speed transceivers, DSP blocks, PLLs and flexible clock networks that align with high-bandwidth and DSP-centric system designs.

Key Features

  • Core Logic — 175,750 logic elements provide a large, flexible programmable fabric for implementing complex digital logic and custom processing pipelines.
  • Embedded Memory — Approximately 14 Mbits of on-chip RAM (13,954,048 bits) supports large buffers, tables, and on-chip data storage for bandwidth-sensitive designs.
  • I/O Density — 564 I/O pins give broad external connectivity for parallel interfaces, memory buses, and mixed-signal system integration.
  • Stratix IV GX Family Features — Family documentation highlights architecture capabilities including high-speed transceivers, DSP blocks, PLLs, and extensive clock network options for high-throughput and signal-processing applications.
  • Power and Voltage — Core voltage supply range specified at 870 mV to 930 mV for the device.
  • Package & Mounting — 1152-BBGA, FCBGA (supplier package listed as 1152-FBGA, 35×35) in a surface-mount form factor suitable for compact, high-density board layouts.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, enabling use in industrial environments.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • High-bandwidth Communications — Implements protocol logic and data-path processing where the Stratix IV GX family’s high-speed transceiver features and large logic capacity are required.
  • Signal Processing and DSP — Hosts DSP-intensive functions and custom accelerators that leverage on-chip memory and DSP block resources noted in the device handbook.
  • External Memory Interfaces — Acts as the programmable bridge or controller for external memory systems, taking advantage of abundant I/O and embedded RAM.
  • Custom Hardware Acceleration — Deploys algorithm-specific accelerators and custom pipelines that benefit from the device’s logic density and clocking resources.

Unique Advantages

  • High Logic Capacity: 175,750 logic elements enable large-scale, complex implementations without immediate partitioning across multiple devices.
  • Significant On-chip Memory: Approximately 14 Mbits of embedded RAM reduces dependence on external memory for many buffering and table-based functions.
  • Extensive I/O: 564 I/O pins support wide parallel buses, multiple interfaces, and dense board-level connectivity.
  • Industrial Qualification: −40 °C to 100 °C operating range supports deployment in industrial environments with elevated thermal requirements.
  • Compact, High-density Packaging: 1152-BBGA (FCBGA) surface-mount package enables high-density PCB designs while accommodating the device’s pin count.
  • Low-voltage Core Support: 870–930 mV core supply enables designs optimized for power while matching the device’s specified voltage range.

Why Choose EP4SGX180HF35I3N?

The EP4SGX180HF35I3N combines substantial logic density, abundant on-chip memory, and a high I/O count in an industrial-temperature, surface-mount FCBGA package. It is well suited to systems that require integrated DSP resources, high data throughput, and flexible I/O configurations as outlined in the Stratix IV device documentation.

Designed for engineers building complex communication, signal-processing, and memory-interface systems, this Stratix IV GX device offers scalability and integration that help reduce board-level complexity and support long-term deployment in industrial environments backed by Intel’s device family resources.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX180HF35I3N and to discuss how this Stratix IV GX FPGA can fit your next design.

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