EP4SGX180HF35C4N

The EP4SGX180HF35C4N is an Intel Stratix IV GX FPGA family device offering high logic density and extensive I/O in a 1152‑ball FCBGA package. It targets designs that require large on‑chip memory, significant logic resources, and high‑speed I/O capability.

With 175,750 logic elements and approximately 13.95 Mbits of embedded memory, this commercial‑grade FPGA is suited for systems that demand high aggregate data bandwidth, flexible FPGA fabric and I/O features, and integrated DSP and clocking resources as described in the device handbook.

Key Features

• High Logic Density — 175,750 logic elements to implement complex digital functions, state machines, and custom hardware acceleration.
• Embedded Memory — Approximately 13.95 Mbits of on‑chip RAM for buffering, packet processing, and local storage of intermediate data.
• Extensive I/O — 564 I/O pins to support wide external connectivity and multiple parallel interfaces.
• High‑Speed Transceiver and I/O Architecture — Device handbook lists high‑speed differential I/O and transceiver features designed to support high aggregate data bandwidth and a wide range of protocol support.
• DSP and Clocking Resources — Includes dedicated digital signal processing blocks and PLL/clock network features referenced in the Stratix IV device handbook for timing and signal processing tasks.
• Power and Supply — Specified core voltage supply range of 870 mV to 930 mV to match system power design requirements.
• Package and Mounting — 1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35) with surface‑mount construction for board‑level integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C ambient operation, suitable for commercial applications.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead‑free manufacturing.

Typical Applications

• High‑bandwidth Networking and Communications — Use where high aggregate data throughput and high‑speed I/O/transceiver support are required.
• Memory Interface and Controller Design — Leverage abundant I/O and embedded memory for external memory interfaces and buffering tasks.
• DSP‑intensive Systems — Implement signal processing chains and hardware accelerators using the device’s DSP resources and large logic fabric.
• System Integration and Prototyping — Consolidate multiple functions into a single FPGA for complex system prototypes and integration tasks.

Unique Advantages

• Substantial Logic Capacity: 175,750 logic elements allow implementation of large custom circuits and multiple subsystems in one device, reducing board-level component count.
• Significant On‑Chip RAM: Approximately 13.95 Mbits of embedded memory supports deep buffering and local data storage without relying solely on external memory.
• Broad I/O Count: 564 I/O pins provide flexibility for parallel interfaces, multiple peripheral connections, and wide data buses.
• Commercial‑grade Readiness: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product and assembly requirements.
• Integrated Clocking and DSP Resources: On‑chip PLLs, clock networks, and DSP blocks referenced in the device handbook simplify timing and signal processing implementation.
• Industry‑recognized FPGA Family: Stratix IV GX architecture features documented high‑speed transceiver and protocol support, aiding design planning for high‑throughput applications.

Why Choose EP4SGX180HF35C4N?

The EP4SGX180HF35C4N positions itself for designs that require a combination of high logic density, substantial embedded memory, and wide I/O capability in a commercial‑grade FPGA. Its feature set—called out in the Stratix IV device handbook—supports developers implementing high‑bandwidth interfaces, DSP workloads, and complex system integration on a single programmable device.

This part is well suited for engineers and teams building scalable hardware where on‑chip resources, configurable fabric, and documented transceiver/I/O architectures are key to meeting system throughput and integration goals.

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