EP4SGX110HF35C3

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA

Quantity 1,112 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110HF35C3 – Stratix® IV GX Field Programmable Gate Array (FPGA) IC

The EP4SGX110HF35C3 is a Stratix IV GX field programmable gate array from Intel, delivered in a 1152-ball BGA (FCBGA) package for surface-mount applications. The device provides a high-density programmable fabric with a large logic resource pool and substantial on-chip memory capacity.

Designed for commercial-grade systems, this FPGA combines 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 488 user I/Os. The device handbook and datasheet provide device-level electrical, timing and configuration details to support system integration and design verification.

Key Features

  • Core density  105,600 logic elements to implement complex programmable logic and custom datapaths.
  • Embedded memory  Approximately 9.79 Mbits of on-chip RAM for buffering, FIFOs and local storage.
  • I/O capacity  488 available I/Os to support wide buses, parallel interfaces and multi-channel connectivity.
  • Package and mounting  1152-ball BGA package (1152-FBGA, 35×35) in an FCBGA footprint; surface-mount mounting type for typical board-level assembly.
  • Power  Core supply range specified from 870 mV to 930 mV to match system power rails and design constraints.
  • Operating conditions & grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Regulatory compliance  RoHS-compliant material composition for environmental compliance in commercial products.
  • Comprehensive device documentation  Device handbook and datasheet coverage includes DC and switching characteristics, recommended operating conditions, I/O standard specifications, power consumption, PLL specifications, DSP block specifications, transceiver performance specifications, configuration and JTAG details, and temperature sensing information.

Typical Applications

  • High-density programmable logic  Systems that require a large pool of logic elements for custom hardware acceleration or complex state machines.
  • Memory-intensive embedded designs  Designs that benefit from approximately 9.79 Mbits of on-chip RAM for buffering, packet staging or local storage.
  • High-pin-count interfaces  Applications that need extensive I/O connectivity—up to 488 I/Os—for parallel buses, multi-channel sensors, or board-level interconnect.
  • Surface-mount module integration  Use in high-density board assemblies that accept 1152-ball FCBGA packages for compact system integration.

Unique Advantages

  • Large programmable fabric: 105,600 logic elements provide headroom for complex combinational and sequential logic implementations.
  • Substantial on-chip RAM: Approximately 9.79 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
  • High I/O count: 488 I/Os enable broad connectivity and the ability to interface directly with multiple peripherals or bus systems.
  • Compact, industry-standard packaging: 1152-ball FCBGA (35×35) provides a high-density package option suitable for space-constrained assemblies.
  • Well-documented device specifications: The Stratix IV device handbook and datasheet include detailed sections on electrical characteristics, power consumption, PLLs, DSP blocks and configuration/JTAG to support design and verification.
  • Commercial-grade suitability: Specified operating range of 0 °C to 85 °C and RoHS compliance for commercial product deployment.

Why Choose EP4SGX110HF35C3?

The EP4SGX110HF35C3 targets designs that need a high-density Stratix IV GX FPGA fabric with substantial embedded memory and a large number of I/Os in a compact BGA package. Its specification set—including 105,600 logic elements, approximately 9.79 Mbits of on-chip RAM, 488 I/Os, and a 1152-ball FCBGA package—makes it suitable for commercial systems that require significant programmable logic capacity and board-level integration.

Extensive device documentation and the Stratix IV device handbook supply the electrical, timing and configuration details needed for system integration and test, helping teams evaluate fit and accelerate development for medium- to high-complexity FPGA-based designs.

Request a quote or submit an inquiry to check availability and pricing for EP4SGX110HF35C3. Our team can provide part quantities, lead time and ordering information to support your next design cycle.

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