EP4SGX110HF35C2G

IC FPGA 488 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 488 9793536 105600 1152-BBGA, FCBGA

Quantity 827 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O488Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110HF35C2G – Stratix® IV GX FPGA, 1152-FBGA (35×35)

The EP4SGX110HF35C2G is a Stratix IV GX field-programmable gate array (FPGA) in a 1152‑ball FCBGA package. It implements the Stratix IV GX device family architecture and is intended for applications that require a high-capacity programmable fabric with extensive I/O and on‑chip memory.

Built for bandwidth‑ and integration‑focused designs, this commercial‑grade device combines a large logic fabric, embedded memory, and high‑speed I/O resources to support protocols and system interfaces that demand significant routing and processing resources.

Key Features

  • Core Logic — Provides 105,600 logic elements for implementing complex programmable logic, state machines, and custom accelerators.
  • Embedded Memory — Approximately 9.79 Mbits of on‑chip RAM to support buffering, LUTRAM, and memory‑mapped functions within the FPGA fabric.
  • I/O Density — Up to 488 I/O pins to accommodate wide external interfaces and multiple peripheral connections.
  • High‑Speed Transceiver and I/O Features — Implements Stratix IV GX device family transceiver and high‑speed differential I/O capabilities as described in the device handbook for protocol support and signal‑integrity features.
  • Clocking and DSP Resources — Includes Stratix IV architecture elements such as PLLs, clock networks, and DSP blocks for deterministic timing and signal processing integration.
  • Package and Mounting — 1152‑BBGA (FCBGA) 35 × 35 mm supplier device package optimized for surface‑mount assembly.
  • Power Supply — Core supply range specified at 870 mV to 930 mV to match system power rails and power budgeting.
  • Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS‑compliant for lead‑free manufacturing requirements.

Typical Applications

  • Networking and Communications — Use the device’s high logic capacity, embedded memory, and Stratix IV GX transceiver features to implement packet processing, protocol bridging, and high‑bandwidth interfaces.
  • Video and Broadcast Systems — Leverage on‑chip RAM and parallel I/O to support video frame buffering, format conversion, and real‑time data paths.
  • High‑Performance Data Processing — Deploy logic and DSP resources to accelerate algorithmic workloads and custom data‑path functions where large programmable fabrics are required.
  • Test and Measurement Equipment — Combine extensive I/O, deterministic clocking, and embedded memory to implement complex capture, analysis, and control logic.

Unique Advantages

  • High Logic Capacity: 105,600 logic elements enable large, integrated designs that reduce the need for multiple discrete components.
  • Significant On‑Chip Memory: Approximately 9.79 Mbits of embedded RAM support local buffering and data paths, simplifying external memory requirements.
  • Robust I/O Count: 488 I/Os provide flexibility for wide buses, multiple interfaces, and high‑pin‑count external connections.
  • Stratix IV GX Architecture: Device family features such as high‑speed transceivers, DSP blocks, and advanced clocking facilitate protocol support and high aggregate data bandwidth.
  • Compact FCBGA Package: The 1152‑ball FCBGA (35×35) delivers high density in a surface‑mount form factor suitable for compact system boards.
  • Commercial Grade and RoHS Compliant: Specified operating range of 0 °C to 85 °C and RoHS compliance meet common commercial manufacturing and deployment requirements.

Why Choose EP4SGX110HF35C2G?

The EP4SGX110HF35C2G positions itself as a high‑capacity Stratix IV GX FPGA option for designs requiring extensive programmable logic, substantial embedded memory, and a large complement of I/O. The combination of Stratix IV architecture features—high‑speed transceivers, DSP blocks, and advanced clocking—aligns this device to applications that need integrated processing and flexible protocol support.

This device is well suited for engineering teams building bandwidth‑intensive communications, video, data‑processing, and instrumentation systems that prioritize integration and on‑chip resource availability. RoHS compliance and a surface‑mount FCBGA package support modern manufacturing flows and compact board designs.

If you would like pricing, availability, or to request a formal quote for EP4SGX110HF35C2G, please submit a quote request or contact your procurement channel to initiate the process.

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