EP4SGX110FF35C3N

The EP4SGX110FF35C3N is a Stratix IV GX field‑programmable gate array (FPGA) IC built for high‑integration, high‑bandwidth system designs. It combines a large programmable fabric with on‑chip memory and extensive I/O to address applications that require dense logic, embedded memory, and high‑speed interfaces.

This commercial‑grade device is suited to designs that leverage Stratix IV GX architecture features such as high‑speed transceiver support, DSP capabilities, embedded memory, and external memory interfaces as described in the Stratix IV device documentation.

Key Features

• Core Logic  105,600 logic elements and 4,224 logic array blocks provide substantial programmable fabric for complex logic implementation.
• Embedded Memory  Approximately 9.8 Mbits of on‑chip RAM to support buffering, packet processing, and on‑die data structures.
• I/O Density  372 user I/O pins to support broad system interfacing and multiple external device connections.
• Package and Mounting  1152‑BBGA (1152‑FBGA, 35×35) FCBGA package designed for surface‑mount assembly in compact board layouts.
• Power  Core voltage supply range specified at 870 mV to 930 mV for device power planning and regulator selection.
• Operating Range  Commercial temperature grade rated from 0 °C to 85 °C for standard commercial and enterprise environments.
• Compliance  RoHS‑compliant material status to meet environmental and manufacturing requirements.
• Architecture Highlights (Series)  Documentation for the Stratix IV family identifies high‑speed transceiver features, DSP blocks, PLLs, and extensive clock networks for designs requiring advanced timing and interface support.

Typical Applications

• High‑bandwidth Networking  Implements packet processing, protocol bridging, and interface aggregation using the device’s dense logic, embedded memory, and high I/O count.
• Digital Signal Processing  Supports DSP‑centric functions and algorithm acceleration leveraging the Stratix IV family DSP resources and on‑chip memory.
• Video and Imaging  Serves as a processing fabric for video pipelines and image processing chains that need large logic capacity and memory buffering.
• External Memory Interfaces  Integrates with external memory systems using the device’s supported external memory interface features described in the device handbook.

Unique Advantages

• Substantial Logic Capacity: 105,600 logic elements give designers the headroom to implement complex, integrated systems on a single device, reducing board‑level component count.
• Significant On‑Chip Memory: Approximately 9.8 Mbits of embedded RAM enables local buffering and state storage without immediate reliance on external memory.
• High I/O Count: 372 I/O pins provide flexibility for multi‑lane interfaces, wide datapaths, and mixed signal connections.
• Compact, Serviceable Package: The 1152‑BBGA FCBGA package supports dense PCB layouts while remaining compatible with standard surface‑mount assembly processes.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS‑compliant construction for standard commercial deployments.
• Documented Stratix IV GX Architecture: Series documentation details transceiver, DSP, clocking, and memory features that help accelerate design integration and validation.

Why Choose EP4SGX110FF35C3N?

The EP4SGX110FF35C3N positions itself as a high‑capacity Stratix IV GX FPGA option for systems that require dense logic, substantial embedded memory, and broad I/O connectivity in a single commercial‑grade device. Its specified core voltage window and surface‑mount FCBGA package support conventional power delivery and assembly workflows.

This device is a practical choice for engineering teams building networking, DSP, video, or memory‑centric designs that leverage the Stratix IV family architecture. The combination of logic density, on‑chip RAM, and documented high‑speed interface features delivers long‑term flexibility across iterations of a design.

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