EP4SGX110FF35C2XG

The EP4SGX110FF35C2XG is a Stratix IV GX Field Programmable Gate Array (FPGA) from Intel, provided in a 1152‑FBGA (35×35) package for surface‑mount assembly. It combines a high logic element count with substantial embedded memory and dedicated I/O to address complex digital processing and high‑speed interface tasks.

This device is targeted at commercial applications that require large FPGA fabric, extensive on‑chip RAM, and integrated high‑speed I/O and transceiver support as described in the Stratix IV device handbook.

Key Features

• Large Logic Fabric — 105,600 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory — Approximately 9.8 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• High I/O Count — 372 I/O pins to accommodate external interfaces, parallel buses, and mixed signaling requirements.
• High‑Speed Transceiver Capability — Stratix IV GX family features high‑speed transceiver and protocol support as detailed in the device handbook, suitable for serial link and protocol bridging tasks.
• DSP and timing resources — Device handbook references integrated DSP blocks, PLLs and dedicated clock networks to support signal processing and precise timing requirements.
• Package and Mounting — 1152‑FBGA (35×35) FCBGA package, surface mount configuration for board‑level production.
• Power and Thermal — Supported core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C; commercial grade.
• Compliance — RoHS compliant.

Typical Applications

• High‑speed communications — Implement protocol bridging, serialization/deserialization and link aggregation using the device’s high‑speed transceiver features and abundant logic resources.
• Packet and data processing — Use the large logic fabric and approximately 9.8 Mbits of embedded memory for packet buffering, parsing, and custom packet processing engines.
• External memory controllers and interfaces — Leverage the device’s I/O resources and device family support for external memory interfaces and high‑bandwidth data paths.
• Signal processing and DSP — Apply integrated DSP blocks and clock/PLL resources for acceleration of filtering, modulation, and other realtime signal processing tasks.

Unique Advantages

• High integration density: 105,600 logic elements and substantial embedded RAM reduce the need for external glue logic and memory, simplifying board design.
• Broad I/O and interface capability: 372 I/O pins provide flexibility for parallel and serial interfaces, enabling complex system interconnects without additional multiplexing.
• Designed for high‑speed links: Stratix IV GX transceiver and protocol support (per the Stratix IV handbook) enable implementation of multi‑lane serial links and protocol converters.
• Commercial‑grade operating range: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
• Surface‑mount 1152‑FBGA package: Compact FCBGA footprint suitable for production assemblies where space and routing density are considerations.

Why Choose EP4SGX110FF35C2XG?

The EP4SGX110FF35C2XG positions itself as a high‑capacity Stratix IV GX FPGA option for commercial applications that require extensive logic, significant embedded memory, and robust I/O resources. Its inclusion in the Stratix IV device family provides access to the architecture elements described in the device handbook—high‑speed transceivers, DSP blocks, PLLs and clock networks—making it suitable for demanding communications, data processing, and interface tasks.

Designs that demand scalability in logic and memory while maintaining a commercial temperature and voltage profile will benefit from the integration and resource balance this device offers, backed by Intel’s Stratix IV documentation and ecosystem.

Request a quote or submit a pricing inquiry to receive availability and lead‑time information for the EP4SGX110FF35C2XG. Our team can assist with volume pricing and technical details to support your design planning.