EP4SGX110DF29I4N

The EP4SGX110DF29I4N is a Stratix IV GX field‑programmable gate array (FPGA) IC from Intel, provided in a 780‑FBGA (29×29) surface‑mount package. It delivers a large programmable fabric with on‑chip memory and extensive I/O to support high‑bandwidth and protocol‑rich designs.

Built on the Stratix IV GX device family architecture, this industrial‑grade device targets applications that require substantial logic capacity, embedded memory, and high aggregate data bandwidth as described in the device handbook.

Key Features

• Logic Capacity — 105,600 logic elements provide substantial programmable resources for complex digital designs.
• Logic Array Blocks — 4,224 logic array blocks (LABs/CLBs) support structured implementation of logic and routing resources.
• Embedded Memory — Approximately 9.79 Mbits of on‑chip RAM to implement FIFOs, buffers, and local data storage.
• I/O Density — 372 user I/O pins to interface with external devices and high‑speed links.
• High‑Speed Architecture — Stratix IV GX family features in the device handbook include high‑speed transceiver capabilities, support for a wide range of protocols, and architectures focused on high aggregate data bandwidth.
• Package & Mounting — 780‑BBGA FCBGA, surface‑mount supplier package (780‑FBGA, 29×29) for compact board integration.
• Power — Core voltage supply range specified at 870 mV to 930 mV to match target power rails and design requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial environments.
• Compliance — RoHS‑compliant to meet environmental regulations.

Typical Applications

• High‑Bandwidth Networking — Implement packet processing, switching, and protocol bridging using the device’s logic capacity and high‑speed architecture.
• Telecom & Data Communications — Use the Stratix IV GX family features to build protocol‑rich interfaces and high aggregate data bandwidth links.
• Signal Processing & DSP — Deploy embedded memory and the device family’s DSP block capabilities described in the handbook for real‑time signal processing tasks.
• High‑Speed Data Acquisition — Leverage dense I/O and on‑chip RAM to capture and buffer high‑rate data streams.

Unique Advantages

• Large Logic Fabric: 105,600 logic elements enable implementation of complex state machines, custom accelerators, and large glue logic without external ASICs.
• Substantial On‑Chip Memory: Approximately 9.79 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• High I/O Count: 372 I/O pins provide flexibility for multi‑lane interfaces, parallel data buses, and broad peripheral connectivity.
• Industrial‑Grade Thermal Range: −40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
• Compact BGA Packaging: 780‑FBGA (29×29) package offers a high‑density footprint for space‑constrained PCBs while maintaining robust solderable mounting.
• Standards‑Oriented Architecture: Device handbook references to high‑speed transceivers and protocol support help accelerate designs that require diverse communication standards.

Why Choose EP4SGX110DF29I4N?

The EP4SGX110DF29I4N positions itself as a high‑capacity Stratix IV GX FPGA option that balances extensive logic resources, embedded memory, and plentiful I/O in a single industrial‑rated package. Its specified core voltage range and BGA packaging make it suitable for designs that demand compact board integration and consistent power rail definition.

This device is well suited to engineering teams building high‑throughput networking, telecom, signal processing, and data acquisition systems that rely on the Stratix IV GX family architecture and the capabilities documented in the device handbook. The combination of logic density, on‑chip RAM, and device‑level features supports scalable, protocol‑rich designs with long‑term maintainability.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for EP4SGX110DF29I4N.