EP4SGX110DF29I3N

The EP4SGX110DF29I3N is an Intel Stratix IV GX field programmable gate array (FPGA) provided in a 780-BBGA FCBGA package. It delivers a high-density programmable logic fabric with 105,600 logic elements and approximately 9.79 Mbits of embedded memory for complex digital designs.

Built as an industrial-grade, surface-mount device, this FPGA offers a broad I/O complement and defined operating and power ranges to support designs that require scalability, high I/O counts, and on-chip memory capacity.

Key Features

• Core Logic Capacity — 105,600 logic elements to implement large-scale programmable logic and custom digital functions.
• Embedded Memory — Approximately 9.79 Mbits of on-chip RAM to support buffering, data processing, and state storage within the FPGA fabric.
• I/O Count — 372 I/O pins to enable wide connectivity options for parallel interfaces, bus bridging, and multiple peripheral connections.
• Package & Mounting — 780-BBGA FCBGA package (supplier device package: 780-FBGA, 29×29) with surface-mount mounting for high-density board integration.
• Power Supply Range — Core voltage specified from 870 mV to 930 mV, allowing precise power budgeting for core supply design.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C for deployment in industrial environments.
• Regulatory Compliance — RoHS compliant for adherence to environmental requirements.

Typical Applications

• High-density digital systems — Implement complex FPGA-based processing, custom logic blocks, and large combinational/sequential designs that require substantial logic and memory resources.
• I/O‑intensive interfaces — Drive multi-channel or wide-parallel interfaces where a high pin-count FPGA is necessary for signal routing and protocol handling.
• Industrial control and automation — Deploy in industrial-grade boards requiring extended temperature operation and robust programmable logic for control, sequencing, and data handling.

Unique Advantages

• Large programmable capacity: 105,600 logic elements enable implementation of complex algorithms and multi-function designs on a single device.
• Significant on-chip memory: Approximately 9.79 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• Extensive connectivity: 372 I/O pins support dense peripheral and interface requirements, minimizing the need for external I/O expanders.
• Industrial-grade operating range: −40°C to 100°C rating helps ensure reliable operation in temperature-demanding environments.
• Compact FCBGA packaging: 780-BBGA (29×29) surface-mount package provides a balance of routing density and board-space efficiency for high-performance designs.
• Environmental compliance: RoHS compliance supports regulatory requirements for environmental safety.

Why Choose EP4SGX110DF29I3N?

The EP4SGX110DF29I3N positions itself as a high-density, industrial-grade FPGA solution that combines a large logic element count, substantial embedded memory, and a high I/O complement in a compact FCBGA package. Its specified core voltage range and wide operating temperature make it appropriate for designs that require defined power and environmental margins.

This device is suited to engineering teams building complex programmable systems that need on-chip memory, plentiful I/O, and the ability to consolidate multiple functions into a single FPGA. Its combination of capacity and industrial ratings supports long-term design scalability and deployment in temperature-challenging environments.

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