EP4SGX110DF29C4N

The EP4SGX110DF29C4N is a Stratix® IV GX field programmable gate array (FPGA) manufactured by Intel. It delivers high logic density with 105,600 logic elements and substantial on-chip memory, making it suitable for board-level designs that require dense programmable logic and extensive I/O.

Packaged in a 780-ball BGA (29 × 29) surface-mount package and rated for commercial operation, this device offers a balance of integration, I/O capacity, and low-voltage operation for designers targeting compact, high-density FPGA implementations.

Key Features

• Logic Capacity  105,600 logic elements provide a large fabric for complex digital designs and custom logic implementations.
• Embedded Memory  Approximately 9.79 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage for logic-intensive applications.
• I/O Resources  372 I/O pins accommodate multiple external interfaces and high pin-count system connections.
• Package  780-BBGA (FCBGA) in a 29 × 29 ball configuration enables high-density board integration in a surface-mount form factor.
• Power  Designed to operate with a core supply in the range of 870 mV to 930 mV, allowing designs that target specific low-voltage power domains.
• Operating Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Data Processing & Acceleration  Use the high logic element count and embedded memory to implement complex algorithms and hardware-accelerated functions.
• I/O-Intensive Systems  372 I/O pins support systems that require many external interfaces, sensors, or peripheral connections.
• High-Density Board Integration  The 780-BBGA surface-mount package is suited for compact, high-density PCB designs that prioritize board space efficiency.

Unique Advantages

• High Logic Density: 105,600 logic elements allow consolidation of large designs onto a single FPGA, reducing the need for multiple devices.
• Substantial On-Chip Memory: Approximately 9.79 Mbits of embedded RAM enables efficient local buffering and state storage without external memory.
• Extensive I/O Count: 372 I/O pins provide flexibility for interfacing with many peripherals or multiple high-bandwidth channels.
• Compact, High-Pin Package: 780-BBGA (29 × 29) packaging delivers high pin density in a surface-mount form factor for space-constrained boards.
• Low-Voltage Core Operation: Core voltage range of 870 mV to 930 mV supports integration into low-voltage power architectures.
• Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments.

Why Choose EP4SGX110DF29C4N?

The EP4SGX110DF29C4N positions itself as a high-density, commercially rated FPGA solution from Intel, combining a large logic fabric, significant embedded memory, and a high I/O count in a compact 780-BBGA surface-mount package. It is well suited for designers who need to implement complex digital logic, integrate multiple interfaces, and maintain a compact board footprint.

With its combination of capacity, on-chip memory, and RoHS compliance, this FPGA offers a practical option for commercial designs that require scalable logic resources and dense I/O in a defined operating temperature and voltage range.

Request a quote or submit a procurement inquiry for EP4SGX110DF29C4N to begin the sourcing process for your design requirements.