EP4SGX110DF29C3G

The EP4SGX110DF29C3G is an Intel Stratix® IV GX field-programmable gate array (FPGA) offering a high-density fabric and on-chip resources for compute- and interface-intensive designs. Built on the Stratix IV GX device family architecture, it integrates abundant logic, embedded memory and advanced I/O features to support data-path acceleration and high-speed protocol implementation.

This commercial-grade, surface-mount FPGA is suited for applications requiring substantial logic capacity, significant on-chip RAM and a large number of I/Os, while operating within a 0 °C to 85 °C temperature range and a supply window of 870 mV to 930 mV.

Key Features

• Core logic  105,600 logic elements provide the programmable fabric for complex digital functions and custom hardware acceleration.
• Embedded memory  Approximately 9.79 Mbits of on-chip RAM to support large buffering, packet processing and local data storage.
• I/O capacity  372 user I/Os enable extensive peripheral interfacing, multi-channel connectivity and parallel data paths.
• High-speed transceiver and interface features  Stratix IV GX family documentation lists high-speed transceiver and external memory interface capabilities suitable for protocol and link implementations.
• Power and operating range  Specified supply range of 870 mV to 930 mV with commercial operating temperature from 0 °C to 85 °C.
• Package and mounting  780-BBGA FCBGA package (supplier package: 780-FBGA, 29×29) for high-density board integration; surface-mount mounting type.
• Regulatory status  RoHS compliant.

Typical Applications

• High-performance data processing  Use the large logic capacity and embedded RAM for packet processing, custom accelerators and throughput-intensive tasks.
• High-speed serial and protocol bridging  Stratix IV GX family transceiver and I/O features enable implementation of serial links and protocol conversion blocks.
• Memory interface and buffering  On-chip RAM supports buffering and staging for external memory interfaces and streaming data pipelines.
• Custom DSP and signal processing  Leverage the device fabric and embedded memory for fixed-point DSP pipelines and data-path implementations.

Unique Advantages

• High logic density: 105,600 logic elements allow complex designs to be implemented without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 9.79 Mbits of embedded memory reduces dependence on external memory for mid-sized buffers and state storage.
• Large I/O complement: 372 user I/Os provide flexible options for parallel interfaces, multi-lane links and broad peripheral connectivity.
• Commercial operating range: 0 °C to 85 °C and a defined supply window (870 mV–930 mV) make the device suitable for mainstream embedded and communications equipment.
• Dense BGA package: 780-BBGA (780-FBGA, 29×29) supports compact board layouts and high routing density for complex systems.
• Standards-aligned family documentation: Stratix IV GX device handbook material describes device core, transceiver, memory and clocking capabilities to aid design and integration.

Why Choose EP4SGX110DF29C3G?

The EP4SGX110DF29C3G combines substantial logic resources, multiple megabits of embedded memory and an extensive I/O count in a single Stratix IV GX FPGA package, making it appropriate for designs that require on-chip capacity for data-paths, buffering and high-speed interfacing. Its commercial-grade temperature and defined supply range provide predictable operating conditions for mainstream embedded and communications products.

Engineers and system designers seeking a documented Stratix IV GX solution with dense packaging and strong on-chip resource balance will find this device suitable for mid-to-high complexity implementations where integration and on-chip memory reduce system BOM and simplify board-level design.

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