EP4SGX110DF29C3N

The EP4SGX110DF29C3N is a Stratix® IV GX field programmable gate array (FPGA) from Intel, offering a high-capacity, reconfigurable logic solution in a compact ball-grid array package. The device integrates 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 372 I/Os, making it suitable for designs that require substantial on-chip resources and dense I/O in a surface-mount FCBGA footprint.

This commercial-grade FPGA operates with a core supply range of 870 mV to 930 mV and an ambient temperature rating of 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Logic Capacity  105,600 logic elements provide large-scale programmable logic for complex designs.
• Embedded Memory  Approximately 9.79 Mbits of on-chip RAM to support buffering, LUT-based storage, and state retention.
• I/O Scale  372 general-purpose I/O pins to accommodate wide parallel interfaces and multiple peripheral connections.
• Power  Core voltage supply range of 870 mV to 930 mV to support targeted power architectures.
• Package and Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29). Surface-mount mounting for PCB assembly.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High integration density: 105,600 logic elements consolidate complex functions on a single device, reducing board-level component count.
• Significant embedded memory: Approximately 9.79 Mbits of RAM enables local buffering and data storage without external memory for many use cases.
• Extensive I/O count: 372 I/Os support broad interface options and parallel connectivity for multi-channel designs.
• Compact, industry-standard package: 780-BBGA/780-FBGA (29×29) FCBGA provides a dense, surface-mount form factor for space-constrained PCBs.
• Low-voltage core: 870–930 mV supply range supports power-optimized system designs.
• Regulatory compliance: RoHS compliance simplifies environmental qualification for assemblies.

Why Choose EP4SGX110DF29C3N?

The EP4SGX110DF29C3N positions itself as a high-capacity, commercially rated Stratix IV GX FPGA that combines substantial logic resources, embedded memory, and a large I/O complement in a compact BGA package. Its core voltage range and surface-mount FCBGA packaging make it suitable for designs requiring dense integration and power-aware implementations.

Manufactured by Intel, this device targets engineering teams and procurement decisions that need a scalable, resource-rich FPGA option with clear, verifiable specifications for logic, memory, I/O, power, and temperature characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for EP4SGX110DF29C3N.