EP4SGX110DF29I3

The EP4SGX110DF29I3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) IC offering high logic density and substantial embedded memory for demanding designs. It combines 105,600 logic elements, approximately 9.79 Mbits of on‑chip RAM and 372 user I/O, packaged in a 780‑FBGA (29×29) FCBGA for surface‑mount assembly.

Designed for industrial environments, this device supports a wide operating temperature range and a tightly specified core supply voltage, making it suitable for high‑density, memory‑intensive FPGA implementations.

Key Features

• Core / Logic Density 
  105,600 logic elements provide large programmable fabric for complex digital designs and parallel processing.
• Embedded Memory 
  Approximately 9.79 Mbits of on‑chip RAM to support buffering, lookup tables, and intermediate data storage without immediate reliance on external memory.
• I/O Capacity 
  372 user I/O pins for flexible system interfacing and multiple peripheral connections.
• Power 
  Specified core supply voltage range of 870 mV to 930 mV for predictable power planning and supply design.
• Package & Mounting 
  780‑BBGA / 780‑FBGA (29×29) FCBGA package, surface mount, suitable for high‑density board layouts.
• Temperature & Grade 
  Industrial grade device with an operating temperature range of −40 °C to 100 °C for use in temperature‑variable environments.
• Compliance 
  RoHS compliant to support lead‑free assembly processes.

Typical Applications

• High‑density signal processing 
  Leverage the large logic element count and embedded memory to implement FPGA‑based DSP pipelines and parallel processing engines.
• Memory‑intensive embedded systems 
  Use the approximately 9.79 Mbits of on‑chip RAM for frame buffers, packet buffering, and intermediate storage to reduce external memory dependence.
• Multi‑I/O interfacing 
  Deploy the 372 I/O pins for complex board‑level interfacing, protocol bridging, and multiport connectivity needs.

Unique Advantages

• High logic capacity: The 105,600 logic elements enable implementation of large, feature‑rich designs within a single FPGA device.
• Substantial on‑chip memory: Approximately 9.79 Mbits of embedded RAM helps minimize external memory requirements and simplifies memory architecture.
• Robust I/O count: 372 user I/Os provide the flexibility to connect multiple peripherals and interfaces without external multiplexing.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in temperature‑variable installations.
• Compact, manufacturable package: The 780‑FBGA (29×29) FCBGA surface‑mount package supports dense PCB layouts and standard assembly processes.
• RoHS compliance: Supports lead‑free manufacturing and environmental regulatory requirements.

Why Choose EP4SGX110DF29I3?

The EP4SGX110DF29I3 positions itself as a high‑capacity FPGA solution for designs that require significant programmable logic, substantial embedded memory, and a large number of I/O signals. Its industrial temperature rating and controlled supply voltage range enable predictable integration into robust systems.

This device is well suited to development teams and procurement focused on scalable FPGA implementations that demand on‑chip resources and high I/O density, while maintaining compliance with RoHS assembly practices.

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