EP4SGX110DF29I4
| Part Description |
Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 9793536 105600 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,070 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 372 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 105600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9793536 |
Overview of EP4SGX110DF29I4 – Stratix® IV GX FPGA, 105,600 logic elements, 780-BBGA (29×29)
The EP4SGX110DF29I4 is a Stratix® IV GX field programmable gate array (FPGA) from Intel/Altera designed for high-density, high-throughput digital designs. It integrates a large logic fabric, extensive embedded memory, and high-speed I/O capabilities from the Stratix IV device family to address applications that require substantial on-chip resources and high aggregate bandwidth.
Targeted at industrial applications, this device combines 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 372 I/O pins in a 780-BBGA FCBGA package, offering a compact, surface-mount solution with wide operating temperature and tight core-voltage requirements for demanding environments.
Key Features
- High Logic Density Provides 105,600 logic elements suitable for complex digital designs and large FPGA-based subsystems.
- Significant On-Chip Memory Approximately 9.79 Mbits of embedded memory to support buffering, packet processing, and DSP data storage on chip.
- Extensive I/O 372 I/O pins enable broad external connectivity and high-pin-count system interfaces.
- Stratix IV GX Architecture Part of the Stratix IV family with GX-class device capabilities, including high-speed transceiver and fabric features described in the Stratix IV device handbook.
- Clocking and DSP Support Family-level features include advanced clock networks, PLLs, and DSP block support for signal processing and precision timing functions.
- Robust Packaging 780-BBGA, FCBGA supplier package (780-FBGA, 29×29) with surface-mount mounting type for compact board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
- Core Voltage Operates with a core supply voltage range of 870 mV to 930 mV for defined supply planning and power delivery.
- Regulatory Compliance RoHS-compliant to support environmentally conscious product designs.
Typical Applications
- High-speed communications Leverages Stratix IV GX family transceiver and I/O capabilities to implement protocol engines and high-throughput packet processing functions.
- Signal processing and DSP Combines DSP resources with large on-chip memory to implement filtering, FFTs, and real-time data paths.
- Memory interface controllers Uses the device’s fabric and I/O count to build external memory interfaces and high-bandwidth buffer management.
- System integration and prototyping High logic element and memory capacity enable integration of multiple subsystems and rapid prototyping of complex FPGA-based designs.
Unique Advantages
- High on-chip capacity: 105,600 logic elements and approximately 9.79 Mbits of embedded memory reduce reliance on external logic and RAM, simplifying BOM and board routing.
- High I/O count: 372 I/O pins provide flexibility for multi-channel interfaces and parallel external connections without immediate need for expansion devices.
- Industrial-ready thermal range: Rated −40 °C to 100 °C for deployment in industrial environments where extended temperature tolerance is required.
- Controlled core voltage: Defined 870 mV–930 mV supply window supports predictable power budgeting and delivery designs.
- Proven Stratix IV GX family features: Device benefits from Stratix IV architecture elements such as high-speed transceivers, clocking resources, and DSP support as documented in the Stratix IV device handbook.
- RoHS compliant packaging: Environmentally compliant assembly in a 780-BBGA FCBGA package for compact, surface-mount applications.
Why Choose EP4SGX110DF29I4?
The EP4SGX110DF29I4 positions itself as a high-density, industrial-grade FPGA option within the Stratix IV GX family, delivering a combination of large logic capacity, substantial embedded memory, and extensive I/O in a compact 780-BBGA package. It is suited to engineers who need a single-device solution for integrating compute, I/O, and memory-heavy functions while maintaining strict thermal and power constraints.
As part of the Stratix IV device family from Intel/Altera, this device aligns with documented architecture features—such as high-speed transceivers, clock networks, PLLs, and DSP block support—making it a practical choice for designs that require scalability, on-chip bandwidth, and vendor-documented resources for system implementation and verification.
Request a quote or submit a sales inquiry to get pricing and availability details for the EP4SGX110DF29I4. Our team can provide lead-time information and support for integrating this Stratix IV GX FPGA into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018