EP4SGX110DF29I4

IC FPGA 372 I/O 780FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 9793536 105600 780-BBGA, FCBGA

Quantity 1,070 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110DF29I4 – Stratix® IV GX FPGA, 105,600 logic elements, 780-BBGA (29×29)

The EP4SGX110DF29I4 is a Stratix® IV GX field programmable gate array (FPGA) from Intel/Altera designed for high-density, high-throughput digital designs. It integrates a large logic fabric, extensive embedded memory, and high-speed I/O capabilities from the Stratix IV device family to address applications that require substantial on-chip resources and high aggregate bandwidth.

Targeted at industrial applications, this device combines 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 372 I/O pins in a 780-BBGA FCBGA package, offering a compact, surface-mount solution with wide operating temperature and tight core-voltage requirements for demanding environments.

Key Features

  • High Logic Density  Provides 105,600 logic elements suitable for complex digital designs and large FPGA-based subsystems.
  • Significant On-Chip Memory  Approximately 9.79 Mbits of embedded memory to support buffering, packet processing, and DSP data storage on chip.
  • Extensive I/O  372 I/O pins enable broad external connectivity and high-pin-count system interfaces.
  • Stratix IV GX Architecture  Part of the Stratix IV family with GX-class device capabilities, including high-speed transceiver and fabric features described in the Stratix IV device handbook.
  • Clocking and DSP Support  Family-level features include advanced clock networks, PLLs, and DSP block support for signal processing and precision timing functions.
  • Robust Packaging  780-BBGA, FCBGA supplier package (780-FBGA, 29×29) with surface-mount mounting type for compact board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
  • Core Voltage  Operates with a core supply voltage range of 870 mV to 930 mV for defined supply planning and power delivery.
  • Regulatory Compliance  RoHS-compliant to support environmentally conscious product designs.

Typical Applications

  • High-speed communications  Leverages Stratix IV GX family transceiver and I/O capabilities to implement protocol engines and high-throughput packet processing functions.
  • Signal processing and DSP  Combines DSP resources with large on-chip memory to implement filtering, FFTs, and real-time data paths.
  • Memory interface controllers  Uses the device’s fabric and I/O count to build external memory interfaces and high-bandwidth buffer management.
  • System integration and prototyping  High logic element and memory capacity enable integration of multiple subsystems and rapid prototyping of complex FPGA-based designs.

Unique Advantages

  • High on-chip capacity: 105,600 logic elements and approximately 9.79 Mbits of embedded memory reduce reliance on external logic and RAM, simplifying BOM and board routing.
  • High I/O count: 372 I/O pins provide flexibility for multi-channel interfaces and parallel external connections without immediate need for expansion devices.
  • Industrial-ready thermal range: Rated −40 °C to 100 °C for deployment in industrial environments where extended temperature tolerance is required.
  • Controlled core voltage: Defined 870 mV–930 mV supply window supports predictable power budgeting and delivery designs.
  • Proven Stratix IV GX family features: Device benefits from Stratix IV architecture elements such as high-speed transceivers, clocking resources, and DSP support as documented in the Stratix IV device handbook.
  • RoHS compliant packaging: Environmentally compliant assembly in a 780-BBGA FCBGA package for compact, surface-mount applications.

Why Choose EP4SGX110DF29I4?

The EP4SGX110DF29I4 positions itself as a high-density, industrial-grade FPGA option within the Stratix IV GX family, delivering a combination of large logic capacity, substantial embedded memory, and extensive I/O in a compact 780-BBGA package. It is suited to engineers who need a single-device solution for integrating compute, I/O, and memory-heavy functions while maintaining strict thermal and power constraints.

As part of the Stratix IV device family from Intel/Altera, this device aligns with documented architecture features—such as high-speed transceivers, clock networks, PLLs, and DSP block support—making it a practical choice for designs that require scalability, on-chip bandwidth, and vendor-documented resources for system implementation and verification.

Request a quote or submit a sales inquiry to get pricing and availability details for the EP4SGX110DF29I4. Our team can provide lead-time information and support for integrating this Stratix IV GX FPGA into your next design.

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