EP4SGX110DF29I4G

The EP4SGX110DF29I4G is an Intel Stratix IV GX field programmable gate array (FPGA) in a 780-ball FCBGA package. It delivers substantial logic capacity, embedded memory, and a large I/O count for industrial-grade designs.

Built on the Stratix IV GX device family, this device targets high-density, performance-oriented applications that require extensive programmable logic, on-chip memory, and robust I/O capability while operating across an industrial temperature range.

Key Features

• Logic Capacity  105,600 logic elements for implementing complex digital functions and large-scale FPGA designs.
• Embedded Memory  Approximately 9.79 Mbits of on-chip RAM to support frame buffering, packet processing, and other memory-intensive tasks.
• I/O Density  372 user I/O pins enabling extensive interfacing with external peripherals and high-pin-count system designs.
• Power Supply  Specified core voltage range of 0.870 V to 0.930 V for the device core power domain.
• Thermal and Environmental  Industrial operating temperature range from −40 °C to 100 °C and RoHS compliance for regulatory alignment.
• Package & Mounting  780-ball FCBGA package (29 × 29) designed for surface-mount assembly in compact board layouts.
• Stratix IV GX Family Characteristics  Device belongs to the Stratix IV GX family; the family documentation describes FPGA fabric, high-speed transceiver features, DSP and memory resources, and clocking architecture.

Typical Applications

• High-Density Logic Integration  Integrate large-scale custom logic functions and system controllers where extensive programmable resources are required.
• Protocol Bridge and Interface Processing  Consolidate multiple interface functions and peripheral handling using the device’s high I/O count and on-chip memory.
• Network and Packet Processing  Implement buffering, packet inspection, and custom packet-handling logic leveraging the embedded RAM and logic capacity.
• Signal Processing Acceleration  Deploy compute-intensive algorithms that benefit from high logic density and the Stratix IV family’s DSP and fabric features (as documented in the device handbook).

Unique Advantages

• High Logic Density: 105,600 logic elements enable complex SoC-style integration and reduce the need for multiple discrete components.
• Substantial On-Chip Memory: Approximately 9.79 Mbits of embedded RAM supports frame storage, FIFOs, and local buffering without external memory for many use cases.
• Extensive I/O Capability: 372 I/O pins provide flexibility for connecting to wide parallel interfaces, multiple peripherals, and high-pin-count subsystems.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements for industrial products.
• Industry-Grade Packaging: 780-ball FCBGA (29×29) supports surface-mount assembly in compact designs while providing robust electrical connections.
• Family-Level Documentation: Stratix IV GX family documentation provides architecture and feature details useful for system-level planning and design.

Why Choose EP4SGX110DF29I4G?

The EP4SGX110DF29I4G positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant programmable logic, embedded memory, and a large number of I/Os. Its specifications—105,600 logic elements, approximately 9.79 Mbits of on-chip RAM, 372 I/Os, and a 0.870–0.930 V core voltage range—make it suitable for complex interface, processing, and control applications within industrial environments.

This device is appropriate for engineering teams building scalable, high-density FPGA-based systems who need a device documented within the Stratix IV GX family and who require long-term stability, industrial temperature operation, and RoHS compliance.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability for the EP4SGX110DF29I4G. Our team can provide the next steps to include this Stratix IV GX FPGA in your design and procurement plans.