EP4SGX110FF35C2XN

The EP4SGX110FF35C2XN is a Stratix® IV GX field-programmable gate array packaged in a 1152-FBGA (35×35) surface-mount package. It delivers a high logic capacity of 105,600 logic elements, approximately 9.79 Mbits of embedded memory, and 372 I/O pins for dense system integration.

Documented device capabilities in the Stratix IV family include on-chip DSP resources, PLLs, transceiver and clock-tree specifications, and configuration/JTAG features, making this device suitable for complex digital designs in communications, networking, compute acceleration, and measurement applications that require large logic capacity and substantial on-chip memory.

Key Features

• Core Logic Density — 105,600 logic elements to implement large-scale digital designs and complex state machines.
• Embedded Memory — Approximately 9.79 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage.
• I/O Capacity — 372 I/O pins for broad peripheral connectivity and parallel interface integration.
• On‑Chip Resources — Device datasheet includes specifications for DSP blocks, PLLs, TriMatrix memory blocks, and high‑speed transceiver performance to support signal processing and interface functions.
• Power and Voltage — Core voltage specified at 0.87 V to 0.93 V, enabling predictable power delivery planning.
• Package & Mounting — 1152-FBGA (35×35) FCBGA package, surface-mount for compact board-level integration.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliant for regulatory and environmental conformity.

Typical Applications

• Telecommunications & Networking — Use the device’s large logic capacity and documented transceiver and clocking resources for packet processing, protocol offload, and interface bridging.
• Digital Signal Processing — Leverage on-chip DSP block specifications and abundant embedded memory for filtering, FFTs, and other compute-heavy signal tasks.
• Data Acquisition & Test Equipment — High I/O count and sizable on-chip RAM make the device suitable for sample buffering, preprocessing, and real-time measurement logic.
• Video and Image Processing — Combine large logic resources and embedded memory to implement video preprocessing pipelines, scaling, and real-time image analysis functions.

Unique Advantages

• High integration density: 105,600 logic elements enable consolidation of complex functions into a single device, reducing board-level BOM and interconnect complexity.
• Substantial on‑chip memory: Approximately 9.79 Mbits of embedded RAM supports large buffers and state storage without external memory.
• Extensive I/O count: 372 I/O pins allow flexible host, sensor, and peripheral interfacing without immediate need for I/O expanders.
• Documented on‑chip resources: Datasheet coverage of DSP blocks, PLLs, transceivers, and TriMatrix memory blocks helps accelerate system design and timing closure.
• Compact board footprint: 1152-FBGA (35×35) surface-mount package provides a balance of density and manufacturability for compact systems.
• Compliant and predictable operation: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance simplify regulatory and production planning.

Why Choose EP4SGX110FF35C2XN?

The EP4SGX110FF35C2XN positions itself as a high-density Stratix IV GX FPGA option for designs that require a large amount of programmable logic, significant embedded memory, and a high number of I/O. Its documented device features—covering DSP resources, PLLs, transceivers, and configuration/JTAG—support complex signal-processing and interface-rich applications.

This device is well suited to system architects and engineers building communications, networking, DSP, and measurement systems who need to consolidate functionality, control board-level complexity, and rely on clear device specifications for timing, power, and interface planning.

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