EP4SGX110FF35C3

The EP4SGX110FF35C3 is an Intel Stratix® IV GX field programmable gate array (FPGA) supplied in a 1152‑FBGA (35×35) package for surface-mount applications. This commercial‑grade FPGA provides a large logic capacity, substantial on‑chip RAM, and a high count of I/O pins for designs that require dense programmable logic and flexible I/O integration.

With 105,600 logic elements, approximately 9.79 Mbits of embedded memory and 372 I/O, the device is suited to designs where on‑chip resources and I/O density are primary considerations. It operates from a supply range of 870 mV to 930 mV and is specified for 0 °C to 85 °C operation.

Key Features

• Core Logic  105,600 logic elements provide extensive programmable logic capacity for complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 9.79 Mbits of on‑chip RAM to support buffering, state storage, and local data processing without external memory for many functions.
• I/O Density  372 user I/O pins enable broad interface flexibility for connecting peripherals, parallel buses, and multi‑lane signaling within the package constraints.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplied as a 1152‑FBGA (35×35) unit intended for surface mount assembly, providing a compact footprint for board integration.
• Power  Supported core supply range from 870 mV to 930 mV to match system power planning and regulator selection.
• Operating Range & Grade  Commercial‑grade device specified for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliance  RoHS‑compliant status for compatibility with environmental and manufacturing requirements.

Typical Applications

• High‑density digital logic  Use the device where large quantities of programmable logic elements and embedded memory are needed to implement complex finite state machines, data path logic, and custom accelerators.
• I/O‑intensive interface bridging  Ideal for designs that require many parallel or serial interfaces and flexible pin allocation across 372 I/Os for protocol conversion and bus interfacing.
• Prototyping and system integration  Suitable for platform prototyping or integration of custom logic into commercial products that operate within the specified temperature and supply ranges.

Unique Advantages

• Large programmable capacity: 105,600 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components and board complexity.
• Significant on‑chip memory: Approximately 9.79 Mbits of embedded RAM supports local buffering and state storage, lowering the need for external memory in many use cases.
• High I/O count: 372 I/Os provide the flexibility to implement multiple interfaces or wide parallel buses without additional I/O expanders.
• Compact, surface‑mount package: The 1152‑FBGA (35×35) package offers a high‑density solution for space‑constrained PCBs while maintaining robust mounting characteristics.
• Commercial operating range: Specified 0 °C to 85 °C operation aligns with standard commercial product requirements and supply planning.
• RoHS compliant: Meets common environmental and manufacturing directives for lead‑free assembly.

Why Choose EP4SGX110FF35C3?

The EP4SGX110FF35C3 combines a large logic fabric, substantial on‑chip memory and a high I/O count in a compact 1152‑FBGA package, making it a practical choice for commercial designs that need dense programmable resources and flexible interfacing. Its supply voltage and operating temperature specifications make integration straightforward for standard commercial systems.

This Intel Stratix® IV GX FPGA is well suited to engineers and system designers seeking to consolidate functionality, reduce external component count, and implement custom logic or interface solutions within commercial temperature and power envelopes.

Request a quote or submit a purchase inquiry to discuss availability, pricing, and lead time for EP4SGX110FF35C3. Our team can provide the information you need to move your design forward.