EP4SGX110FF35C4

IC FPGA 372 I/O 1152FBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 372 9793536 105600 1152-BBGA, FCBGA

Quantity 1,096 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells105600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9793536

Overview of EP4SGX110FF35C4 – Stratix® IV GX FPGA, 1152‑BBGA (372 I/O)

The EP4SGX110FF35C4 is a Stratix® IV GX field programmable gate array in a 1152‑BBGA FCBGA package designed for commercial applications. It delivers high logic density and substantial on‑chip memory, supporting complex digital designs that require large FPGA fabric and flexible I/O.

Built on the Stratix IV GX device family architecture, the device is suited for designs that leverage extensive logic resources, embedded memory, and high‑performance I/O and transceiver features described in the device handbook.

Key Features

  • Logic Capacity — 105,600 logic elements to implement large-scale digital logic, control and custom processing modules.
  • Embedded Memory — Approximately 9.79 Mbits of on‑chip RAM for frame buffering, packet storage, and local data processing.
  • I/O Density — 372 user I/O pins to support wide external connectivity and system interfacing.
  • Package & Mounting — 1152‑BBGA (FCBGA) supplier package (35×35) in a surface‑mount form factor for compact board integration.
  • Power — Core voltage supply range from 870 mV to 930 mV to match platform power budgeting and regulator designs.
  • Operating Range — Commercial temperature grade rated for 0 °C to 85 °C operation.
  • Device Family Features — Stratix IV GX family capabilities documented in the device handbook, including high‑speed transceiver features, DSP blocks, PLLs, clock networks, and extensive I/O feature sets.
  • RoHS Compliant — Manufactured in compliance with RoHS regulations.

Typical Applications

  • High‑performance data processing — Use the large logic fabric and embedded memory for packet processing, custom algorithm acceleration, and data routing.
  • Communications and networking equipment — Leverage the Stratix IV GX device family’s high‑speed transceiver and I/O features for protocol bridging and high‑bandwidth links.
  • External memory interface controllers — Implement memory controllers and interfaces using the device’s logic and embedded memory resources alongside the family’s documented external memory interface features.

Unique Advantages

  • High logic density: 105,600 logic elements provide the headroom to integrate complex system functions on a single FPGA.
  • Substantial on‑chip RAM: Approximately 9.79 Mbits of embedded memory reduces dependence on off‑chip buffering for latency‑sensitive tasks.
  • Robust I/O count: 372 I/O pins enable broad external device connectivity and flexible system partitioning.
  • Compact packaging: 1152‑BBGA (35×35) surface‑mount package supports dense PCB layouts while maintaining manufacturing compatibility.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronics deployments.
  • Documented family features: Backed by the Stratix IV Device Handbook, which details transceiver, DSP, PLL and clocking capabilities for system design planning.

Why Choose EP4SGX110FF35C4?

The EP4SGX110FF35C4 combines large logic capacity, significant embedded memory, and a high I/O count in a compact 1152‑BBGA package, making it a strong fit for commercial systems requiring on‑board processing, high‑throughput data paths, and flexible I/O. Its documented Stratix IV GX family features—such as transceivers, DSP blocks, and advanced clocking—support complex protocol and signal‑processing implementations.

This device is ideal for engineering teams designing high‑density FPGA solutions who need predictable electrical characteristics (870–930 mV core supply), commercial temperature operation, and RoHS compliance for mainstream production environments.

Request a quote or submit a purchasing inquiry to evaluate EP4SGX110FF35C4 for your next FPGA design.

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