EP4SGX110FF35C3G

The EP4SGX110FF35C3G is a Stratix IV GX field-programmable gate array (FPGA) in an FCBGA package designed for high-density, high-bandwidth logic integration. It combines a large logic fabric with on-chip RAM and extensive I/O to address demanding communications, signal processing, and system-integration tasks.

Built on the Stratix IV device family architecture, this commercial-grade device offers approximately 105,600 logic elements and roughly 9.79 Mbits of embedded memory, making it suitable for designs that require substantial programmable logic, memory, and interface capability within a compact 1152-BBGA footprint.

Key Features

• High Logic Density Approximately 105,600 logic elements to implement complex state machines, protocol stacks, and custom accelerators.
• Embedded Memory Approximately 9.79 Mbits of on-chip RAM to support large buffering, lookup tables, and local data storage.
• I/O Capacity 372 I/O pins to support broad external interfacing and multi-channel connectivity.
• Stratix IV GX Architecture Device family features including high-speed transceiver capabilities, DSP resources, clock networks and PLLs as described in the Stratix IV device handbook.
• Package and Mounting 1152-BBGA (35×35) FCBGA package for surface-mount PCB assembly where high-density connection and thermal footprint are considerations.
• Power and Temperature Core supply range 870 mV to 930 mV and commercial operating temperature 0 °C to 85 °C to match standard commercial system environments.
• Compliance RoHS compliant.

Typical Applications

• Networking & Communications: Implement protocol processing, framing, and interface logic using the device's high logic count and I/O capacity.
• High-Speed Serial Systems: Leverage the Stratix IV GX architecture for designs that require high‑bandwidth serial transceiver features and signal conditioning.
• Signal Processing & DSP Acceleration: Deploy on-chip memory and the device family’s DSP-oriented architecture for real-time data processing and algorithm acceleration.
• Memory Interface Controllers: Use the device’s embedded memory and external interface capability to implement complex external memory controllers and buffering schemes.

Unique Advantages

• High integration in a compact package: Large logic capacity and substantial embedded memory packaged in a 1152‑BBGA FCBGA reduces board-level component count.
• Broad I/O support: 372 I/Os provide flexibility for multi-channel designs and diverse peripheral connectivity without external multiplexing.
• Device-family features: Stratix IV GX family capabilities—such as high-speed transceivers, DSP resources, clock networks, and PLLs—enable systems requiring advanced timing and serial interfaces.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial electronics deployments.
• Regulatory compliance: RoHS compliance supports environmentally driven design and procurement requirements.

Why Choose EP4SGX110FF35C3G?

The EP4SGX110FF35C3G positions itself for designs that demand high programmable logic density, significant on-chip memory, and extensive I/O in a single, surface-mount FCBGA package. Its Stratix IV GX architecture provides the building blocks—high-speed transceiver features, DSP-oriented resources, and robust clocking elements—needed to implement complex communications and signal-processing subsystems.

This device is suited to engineering teams and procurement buyers targeting commercial-grade systems that require a balance of integration and capability: substantial logic and memory resources, wide I/O count, and a package footprint compatible with high-density PCB designs.

Request a quote or submit a pricing inquiry to check availability, lead times, and volume pricing for the EP4SGX110FF35C3G.