EP4SGX110DF29C4G

The EP4SGX110DF29C4G is a Stratix IV GX field-programmable gate array (FPGA) in a 780-ball FCBGA package. It provides a high-density programmable logic fabric with extensive on-chip memory and a large count of I/O pins for demanding digital designs.

Built on the Stratix IV GX architecture described in the device handbook, this commercial-grade FPGA is suited for applications requiring significant logic capacity, embedded memory, and substantial external interface connectivity while operating within standard commercial temperature and supply voltage ranges.

Key Features

• Logic Capacity — 105,600 logic elements for implementing complex digital functions and control logic in a single device.
• Embedded Memory — Approximately 9.79 Mbits of on-chip RAM to support buffers, FIFOs, and state storage directly in the FPGA fabric.
• I/O Density — 372 available I/O pins to support wide parallel interfaces and multiple serial/peripheral connections.
• Stratix IV GX Architecture — Device family architecture and high-speed transceiver features are documented in the Stratix IV Device Handbook for high-bandwidth system designs.
• Package & Mounting — 780-ball BGA (FCBGA) 29×29 supplier package, surface-mount mounting type for high-density board designs.
• Power Supply — Core voltage specification of 870 mV to 930 mV to match modern FPGA power rails.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard embedded and industrial-adjacent applications.
• Compliance — RoHS compliant, meeting common lead-free requirements for commercial electronics.

Typical Applications

• High-bandwidth communication systems — Large logic capacity and Stratix IV GX transceiver capabilities support packet processing, switching, and protocol implementations that require significant on-chip resources.
• Signal processing and DSP engines — Approximately 9.79 Mbits of embedded memory combined with abundant logic elements enables implementation of FIR filters, buffering, and real-time data processing.
• External memory interfaces — High I/O count allows robust interfacing to external memory devices and parallel buses for data acquisition and storage applications.
• High-performance embedded systems — Use as a central programmable logic element for system integration, custom accelerators, and glue logic in complex electronic products.

Unique Advantages

• High logic integration: 105,600 logic elements consolidate complex functions into one FPGA, reducing board-level component count.
• Significant embedded memory: Approximately 9.79 Mbits of on-chip RAM minimizes external memory needs for many buffering and stateful functions.
• Extensive I/O capability: 372 I/O pins provide flexibility for parallel interfaces, multiple peripherals, and high-pin-count external connections.
• Compact, manufacturable package: 780-ball FCBGA (29×29) package supports high-density PCB layouts and surface-mount assembly processes.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to match common commercial deployments and environmental expectations.
• Standards-compliant manufacturing: RoHS compliance supports lead-free production requirements.

Why Choose EP4SGX110DF29C4G?

The EP4SGX110DF29C4G positions itself for designs that demand a large programmable fabric, significant on-chip memory, and a high I/O count in a single commercial-grade FPGA package. Its Stratix IV GX heritage and documented device handbook support provide designers with a well-characterized architecture for implementing high-bandwidth and high-complexity logic tasks.

This device is ideal for engineers building performance-oriented embedded systems, communication endpoints, or custom hardware accelerators that benefit from tight integration of logic, memory, and I/O. Its package and supply requirements align with modern PCB assembly flows, and RoHS compliance supports lead-free manufacturing choices.

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