EP4SGX110DF29C3

The EP4SGX110DF29C3 is an Intel Stratix IV GX field-programmable gate array (FPGA) supplied in a 780-BBGA FCBGA package. It provides high logic density and substantial on-chip memory for complex programmable logic designs.

With 105,600 logic elements, approximately 9.79 Mbits of embedded memory and 372 I/Os, this device targets FPGA designs that require large logic capacity, significant embedded RAM, and a high I/O count while operating within commercial temperature and core-voltage ranges.

Key Features

• High Logic Capacity — 105,600 logic elements to implement complex digital logic, state machines and large FPGA designs.
• Embedded Memory — Approximately 9.79 Mbits of on-chip RAM to support buffering, lookup tables and memory-intensive algorithms.
• Extensive I/O — 372 programmable I/O pins for broad interfacing options and system integration.
• Package and Mounting — 780-BBGA, FCBGA supplier package (780-FBGA, 29×29) in a surface-mount form factor for compact board layouts.
• Core Power Range — Core voltage supply specified at 870 mV to 930 mV for system power planning.
• Commercial Grade Temperature — Rated for 0°C to 85°C operation (commercial grade).
• Regulatory — RoHS-compliant construction.
• Documented Architecture — Supported by the Stratix IV device handbook and datasheet content covering PLLs, transceivers, DSP blocks, TriMatrix memory blocks, configuration and JTAG provisions for design reference and verification.

Typical Applications

• High-density FPGA designs — Use the device’s 105,600 logic elements and substantial RAM to implement complex logic and control functions.
• Data buffering and packet processing — Approximately 9.79 Mbits of embedded memory supports packet queues, FIFOs and buffering tasks.
• High I/O integration — 372 I/Os enable dense system interfaces, front-panel connectivity or multi-channel sensor and actuator routing.
• Signal processing and DSP — On-chip resources and documented DSP block specifications make the device suitable for FPGA-based signal-processing blocks.

Unique Advantages

• Large programmable fabric: 105,600 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing component count.
• Significant on-chip memory: Approximately 9.79 Mbits of embedded RAM helps minimize external memory dependencies and simplifies board design.
• High I/O count: 372 I/Os support extensive external connectivity without additional interface components.
• Compact assembly: 780-BBGA FCBGA surface-mount package enables high-density board layouts for space-constrained systems.
• Design reference materials: Comprehensive device handbook and datasheet sections (PLLs, transceivers, DSP, TriMatrix memory, configuration and JTAG) assist with integration and verification.
• Compliance and manufacturability: RoHS compliance and standard commercial temperature range streamline procurement and production for commercial applications.

Why Choose EP4SGX110DF29C3?

EP4SGX110DF29C3 positions itself as a high-capacity Stratix IV GX FPGA option that balances dense logic resources, substantial embedded memory and a large I/O complement in a compact 780-BBGA package. Its documented device handbook coverage supports design implementation across PLLs, transceivers, DSP blocks and memory architectures.

This device is well suited to designers and teams building complex programmable logic systems that require consolidated functionality, robust on-chip RAM and extensive external interfacing within a commercial temperature profile. The combination of logic density, memory capacity and packaging helps support scalable designs with clear documentation for integration.

Request a quote or submit a purchasing inquiry for EP4SGX110DF29C3 to evaluate suitability for your next FPGA design.