EP4SE820H40I4N

The EP4SE820H40I4N is a Stratix® IV E field-programmable gate array (FPGA) device in a 1517-ball BGA package, offered as an industrial-grade, surface-mount component. It integrates high logic density, extensive on-chip memory, and a large I/O count to address demanding data-path, communications, and signal-processing designs.

Built on the Stratix IV E device family architecture, the device is positioned for applications that require high aggregate data bandwidth, complex DSP support and flexible I/O interfacing while maintaining industrial temperature tolerance and RoHS compliance.

Key Features

• Core Logic  Contains 813,050 logic elements to implement large-scale, complex digital functions and custom system logic.
• Embedded Memory  Provides approximately 34 Mbits of embedded memory (34,093,056 bits) for buffering, on-chip storage and data-path acceleration.
• I/O Capacity  Up to 976 programmable I/O pins support wide peripheral connectivity and multiple external interface lanes.
• Stratix IV E Family Features  Device handbook sections indicate family-level support for DSP blocks, PLLs, high-speed transceivers and external memory interfaces suitable for throughput-intensive designs.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-HBGA with a 42.5 × 42.5 mm footprint; surface-mount die packaging for compact board integration.
• Power Supply  Core voltage supply range specified at 870 mV to 930 mV, enabling precise core power provisioning on the target board.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for use in extended-temperature environments.
• Compliance  RoHS-compliant manufacturing to meet regulatory requirements for lead-free assemblies.

Typical Applications

• High-Speed Networking and Communications  Leverage high I/O count and Stratix IV E family transceiver and bandwidth capabilities for data aggregation, switching fabric, and protocol bridging.
• Digital Signal Processing  Large logic capacity and family-level DSP resources support implementation of custom filters, codecs, and real-time signal pipelines.
• External Memory Interfaces  Use on-chip resources and available interface support to connect and manage external DRAM or memory subsystems for buffering and high-throughput storage.
• High-Performance Computing and Acceleration  Deploy the FPGA’s dense logic and memory to offload compute-intensive kernels and accelerate specialized workloads.

Unique Advantages

• High Logic Density: 813,050 logic elements enable consolidation of multiple functions and reduce the need for additional devices on the PCB.
• Substantial On-Chip Memory: Approximately 34 Mbits of embedded memory supports large buffers and reduces external memory bandwidth pressure.
• Extensive I/O Count: 976 I/Os provide flexibility to interface with a wide variety of peripherals, sensors, and high-speed links.
• Industrial Temperature Rating: −40 °C to 100 °C operating range allows deployment in extended-temperature environments.
• Compact BGA Packaging: 1517-ball FCBGA in a 42.5 × 42.5 mm supplier package enables dense PCB routing while supporting surface-mount assembly.
• Standards-Friendly Manufacturing: RoHS compliance supports lead-free assembly requirements.

Why Choose EP4SE820H40I4N?

The EP4SE820H40I4N combines high logic capacity, significant embedded memory and a large I/O complement in an industrial-grade Stratix IV E FPGA package. It is suited to engineers and system designers who need a programmable, high-density platform for throughput-oriented applications where on-chip resources and robust thermal range are important.

Backed by the Stratix IV device documentation, the part offers a clear upgrade path within the family and detailed technical references to support design, integration and qualification workflows for demanding projects.

Request a quote or submit an inquiry for pricing and availability to evaluate how the EP4SE820H40I4N fits your next design.