EP4SE820H40I3N
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA |
|---|---|
| Quantity | 142 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820H40I3N – STRATIX® IV E FPGA — 813,050 logic elements, ~34 Mbits RAM, 976 I/Os
The EP4SE820H40I3N is an Intel Stratix IV E Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It delivers large programmable logic capacity and substantial on-chip memory for demanding digital logic and system-integration tasks.
Documented in the Stratix IV Device Handbook, the device family includes FPGA fabric, embedded memory, DSP blocks, PLLs and advanced I/O features including high-speed transceiver functionality and external memory interface support, making this part suited to high-throughput, industrial applications that require extensive I/O and on-chip resources.
Key Features
- Large FPGA fabric — 813,050 logic elements (logic cells) provide substantial capacity for complex designs and high levels of integration.
- Embedded memory — approximately 34 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
- High I/O count — 976 general-purpose I/Os to support wide external connectivity and complex board-level interfaces.
- High-speed I/O and transceiver features — the Stratix IV Device Handbook lists high-speed differential I/O capabilities and high-speed transceiver features suitable for demanding data paths and protocol support.
- Signal processing and clocking — device family documentation includes DSP block resources, PLLs and extensive clock network features for synchronized, deterministic designs.
- Low-voltage core operation — core supply range from 870 mV to 930 mV for optimized power-domain design.
- Industrial grade and temperature range — specified for industrial operation from −40 °C to 100 °C.
- Package and mounting — supplied in a 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) surface-mount package to support high-density PCB implementations.
- Environmental compliance — RoHS compliant.
Typical Applications
- High-bandwidth networking — leverage the large logic count and high-speed I/O/transceiver features for packet processing, protocol bridging and network acceleration.
- Signal and image processing — use the substantial logic and approximately 34 Mbits of embedded memory together with DSP resources for real-time processing pipelines.
- Industrial control and automation — industrial-grade temperature range and high I/O count enable robust control, sensor aggregation and communication tasks in industrial systems.
- System integration and memory interfacing — extensive I/O and documented external memory interface support simplify designs that require large external memory and multiple peripheral buses.
Unique Advantages
- Highly integrated programmable fabric: 813,050 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
- Substantial on-chip RAM: approximately 34 Mbits of embedded memory supports buffering, frame storage and intermediate data handling without relying solely on external memory.
- Extensive I/O capacity: 976 I/Os enable broad connectivity to peripherals, sensors and high-pin-count interfaces.
- Industrial robustness: Rated for −40 °C to 100 °C operation and specified as Industrial grade for deployments requiring extended temperature range.
- Low-voltage core: Core voltage range of 870 mV to 930 mV supports modern multi-voltage system architectures.
- Compact high-density package: 1517-BBGA FCBGA (1517-HBGA, 42.5 × 42.5 mm) surface-mount package enables dense PCB designs while supporting large logic capacity.
Why Choose EP4SE820H40I3N?
The EP4SE820H40I3N combines large logic density, significant embedded memory and a high I/O count within the Stratix IV E device family architecture documented in the device handbook. Those attributes make it well suited to high-performance, industrial applications that require on-chip resources for real-time processing and broad external connectivity.
For engineering teams designing complex FPGA-based systems, this device offers a balance of integration, industrial temperature capability and package options that support scalable designs and consolidated system functions.
Request a quote or submit an RFQ to begin procurement or to obtain pricing and availability information for EP4SE820H40I3N.

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