EP4SE820H40I3N

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA

Quantity 142 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H40I3N – STRATIX® IV E FPGA — 813,050 logic elements, ~34 Mbits RAM, 976 I/Os

The EP4SE820H40I3N is an Intel Stratix IV E Field Programmable Gate Array (FPGA) offered in a 1517-BBGA FCBGA package. It delivers large programmable logic capacity and substantial on-chip memory for demanding digital logic and system-integration tasks.

Documented in the Stratix IV Device Handbook, the device family includes FPGA fabric, embedded memory, DSP blocks, PLLs and advanced I/O features including high-speed transceiver functionality and external memory interface support, making this part suited to high-throughput, industrial applications that require extensive I/O and on-chip resources.

Key Features

  • Large FPGA fabric — 813,050 logic elements (logic cells) provide substantial capacity for complex designs and high levels of integration.
  • Embedded memory — approximately 34 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
  • High I/O count — 976 general-purpose I/Os to support wide external connectivity and complex board-level interfaces.
  • High-speed I/O and transceiver features — the Stratix IV Device Handbook lists high-speed differential I/O capabilities and high-speed transceiver features suitable for demanding data paths and protocol support.
  • Signal processing and clocking — device family documentation includes DSP block resources, PLLs and extensive clock network features for synchronized, deterministic designs.
  • Low-voltage core operation — core supply range from 870 mV to 930 mV for optimized power-domain design.
  • Industrial grade and temperature range — specified for industrial operation from −40 °C to 100 °C.
  • Package and mounting — supplied in a 1517-BBGA (1517-HBGA, 42.5 × 42.5 mm) surface-mount package to support high-density PCB implementations.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • High-bandwidth networking — leverage the large logic count and high-speed I/O/transceiver features for packet processing, protocol bridging and network acceleration.
  • Signal and image processing — use the substantial logic and approximately 34 Mbits of embedded memory together with DSP resources for real-time processing pipelines.
  • Industrial control and automation — industrial-grade temperature range and high I/O count enable robust control, sensor aggregation and communication tasks in industrial systems.
  • System integration and memory interfacing — extensive I/O and documented external memory interface support simplify designs that require large external memory and multiple peripheral buses.

Unique Advantages

  • Highly integrated programmable fabric: 813,050 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • Substantial on-chip RAM: approximately 34 Mbits of embedded memory supports buffering, frame storage and intermediate data handling without relying solely on external memory.
  • Extensive I/O capacity: 976 I/Os enable broad connectivity to peripherals, sensors and high-pin-count interfaces.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and specified as Industrial grade for deployments requiring extended temperature range.
  • Low-voltage core: Core voltage range of 870 mV to 930 mV supports modern multi-voltage system architectures.
  • Compact high-density package: 1517-BBGA FCBGA (1517-HBGA, 42.5 × 42.5 mm) surface-mount package enables dense PCB designs while supporting large logic capacity.

Why Choose EP4SE820H40I3N?

The EP4SE820H40I3N combines large logic density, significant embedded memory and a high I/O count within the Stratix IV E device family architecture documented in the device handbook. Those attributes make it well suited to high-performance, industrial applications that require on-chip resources for real-time processing and broad external connectivity.

For engineering teams designing complex FPGA-based systems, this device offers a balance of integration, industrial temperature capability and package options that support scalable designs and consolidated system functions.

Request a quote or submit an RFQ to begin procurement or to obtain pricing and availability information for EP4SE820H40I3N.

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