EP4SGX110DF29C2X

The EP4SGX110DF29C2X is an Intel Stratix IV GX Field Programmable Gate Array (FPGA) in a 780-ball FCBGA package. It combines high logic density and substantial on-chip RAM with Stratix IV GX family architecture elements described in the device handbook.

Engineered for demanding, high-bandwidth designs, this commercial-grade FPGA offers a large I/O count and on-chip memory enabling complex signal processing, high-speed interfaces, and system integration in compact surface-mount form factors.

Key Features

• Core Capacity  105,600 logic elements for dense programmable logic and complex digital design implementation.
• Embedded Memory  Approximately 9.79 Mbits of on-chip RAM to support packet buffering, frame storage, and algorithm working memory.
• I/O Resources  372 I/O pins to interface with multiple peripherals, memory devices, and high-bandwidth data paths.
• Stratix IV GX Architecture  Device-level features documented for the Stratix IV family include high-speed transceiver capabilities, DSP blocks, PLLs, and external memory interface support.
• Power  Core voltage supply range from 870 mV to 930 mV to match system power domains and board-level regulators.
• Package & Mounting  780-BBGA (FCBGA), supplier device package 780-FBGA (29×29), designed for surface-mount PCB assembly to minimize board footprint.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• High-Speed Networking and Telecom  Leverage the Stratix IV GX architecture and large logic/memory resources for packet processing, protocol bridging, and line-card functions.
• Signal Processing and DSP  Use the abundant logic elements and embedded RAM to implement real-time filtering, aggregation, and custom DSP pipelines.
• Memory Interface Controllers  Combine the device’s external memory interface support and on-chip resources to build high-bandwidth memory controllers and buffering subsystems.
• Embedded System Integration  Deploy as a central FPGA fabric for custom SoC functions, I/O aggregation, and system-level glue logic in compact surface-mount designs.

Unique Advantages

• High logic density: 105,600 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial embedded RAM: Approximately 9.79 Mbits of on-chip memory reduces external memory dependency for many buffering and state-storage needs.
• Extensive I/O count: 372 I/Os provide flexible external connectivity for peripherals, memory interfaces, and high-speed links.
• Integrated Stratix IV GX features: Architecture-level support for high-speed transceivers, DSP resources, and clocking structures simplifies building high-bandwidth systems.
• Compact package: 780-FBGA (29×29) surface-mount package balances board space economy with large functional capacity.
• Commercial-grade operating range: 0 °C to 85 °C rating aligns with a wide set of general-purpose applications and deployments.

Why Choose EP4SGX110DF29C2X?

The EP4SGX110DF29C2X delivers a combination of high logic capacity, significant on-chip RAM, and extensive I/O in a compact FCBGA package, making it suitable for high-bandwidth, integration-intensive designs. Its Stratix IV GX device family heritage provides architecture features for transceivers, DSP, and memory interfacing documented in the device handbook.

This FPGA is ideal for engineering teams building complex communications, signal processing, or embedded integration solutions who require scalable logic, plentiful on-chip memory, and a commercially rated device with RoHS compliance.

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