EP4SE820H40I4

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA

Quantity 1,996 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H40I4 – STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA

The EP4SE820H40I4 is a Stratix IV E field programmable gate array (FPGA) designed for high‑density, high‑bandwidth system designs. It integrates a large logic fabric, on‑chip embedded memory, DSP resources and high‑speed I/O capabilities tailored to demanding communications, signal processing and data‑throughput applications.

Built for industrial environments, the device offers a broad operating temperature range and a compact FCBGA package for space‑constrained boards, enabling robust deployment in industrial and infrastructure systems.

Key Features

  • Logic Capacity — 813,050 logic elements provide a substantial programmable fabric for complex custom logic, protocol handling and hardware acceleration.
  • Embedded Memory — Approximately 34 Mbits of on‑chip RAM to support buffering, packet processing and local data storage.
  • I/O Density — 976 user I/Os to accommodate wide external interfaces and parallel connections.
  • High‑Speed I/O and Transceivers — Device handbook lists high‑speed differential I/O features including DPA and Soft‑CDR and dedicated transceiver resources for high aggregate data bandwidth and protocol support.
  • DSP and Clocking Resources — Integrated DSP blocks and PLL resources referenced in the device handbook for signal processing and flexible clock management.
  • Package & Mounting — 1517‑BBGA (FCBGA) supplier package 1517‑HBGA (42.5 × 42.5 mm) with surface‑mount mounting for compact board layouts.
  • Power Supply Range — Core voltage specified between 870 mV and 930 mV for system power planning.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Environmentally Compliant — RoHS compliant to meet modern regulatory requirements.

Typical Applications

  • Telecommunications & Networking — Implement high‑bandwidth packet processing, protocol bridging and line‑rate interfaces using the device’s transceiver and logic capacity.
  • Digital Signal Processing — Leverage on‑chip DSP blocks and embedded memory for real‑time filtering, modulation/demodulation and other signal‑processing tasks.
  • Data Acquisition & Instrumentation — Use abundant I/O and local RAM to handle high‑channel count data capture, buffering and preprocessing.
  • Infrastructure & Industrial Systems — Industrial temperature rating and high I/O count make the device suitable for control, automation and embedded infrastructure functions.

Unique Advantages

  • High Logic Integration: 813,050 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board complexity.
  • Substantial On‑Chip Memory: Approximately 34 Mbits of embedded RAM support large buffers and local data storage without immediate dependence on external memory.
  • Extensive I/O Connectivity: 976 I/Os provide flexibility for parallel interfaces, wide data buses and multiple peripheral connections.
  • Designed for High‑Bandwidth Systems: High‑speed differential I/O features and transceiver support from the device handbook help address applications requiring high aggregate data throughput.
  • Industrial Reliability: −40 °C to 100 °C operating range and surface‑mount BBGA packaging support deployment in industrial environments.
  • Regulatory Compliance: RoHS compliance eases integration into modern product designs with current environmental requirements.

Why Choose EP4SE820H40I4?

The EP4SE820H40I4 combines a large programmable fabric, significant embedded memory and extensive I/O in a compact FCBGA package, positioning it for complex, high‑throughput designs where integration and deterministic hardware performance matter. Its documented high‑speed I/O features, DSP resources and clocking options from the Stratix IV device handbook make it suitable for communications, processing and instrumentation systems that need scalable hardware acceleration.

Engineers and procurement teams seeking an industrial‑grade FPGA with substantial logic, memory and I/O capacity will find the EP4SE820H40I4 addresses both functional density and deployment environment requirements while remaining RoHS compliant.

Request a quote or submit an inquiry to obtain pricing, availability and technical assistance for EP4SE820H40I4.

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