EP4SE820H40I3
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA |
|---|---|
| Quantity | 270 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820H40I3 – STRATIX® IV E FPGA, 813,050 logic elements, 976 I/Os, 1517-FCBGA
The EP4SE820H40I3 is a STRATIX® IV E Field Programmable Gate Array (FPGA) IC designed for demanding embedded and industrial applications. It provides a high logic capacity FPGA core combined with a large complement of embedded memory and I/O to address high-throughput, protocol-rich designs.
Targeted use cases include high-speed communications, industrial control and automation, and data-handling or signal-processing systems where large logic resources, extensive on-chip memory, and dense I/O packing are required. The device is specified for industrial temperature operation and low-voltage core supply ranges to support robust deployment scenarios.
Key Features
- Logic Capacity Provides 813,050 logic elements to implement large, complex logic functions and system-level integration on a single device.
- Embedded Memory Approximately 34 Mbits of on-chip RAM (34,093,056 total RAM bits) for buffering, packet processing, and scratchpad memory requirements.
- High I/O Count 976 I/O pins accommodate dense connectivity for multi-channel interfaces, memory buses, and peripheral integration.
- Device Family Capabilities Part of the Stratix IV E device family; device handbook references architecture features such as embedded memory, DSP blocks, PLLs, and high-speed transceiver features for protocol and bandwidth support.
- Power and Voltage Core supply specified from 870 mV to 930 mV to match system power-rail requirements and support predictable power budgeting.
- Package & Mounting Delivered in a 1517-BBGA FCBGA package (supplier device package listed as 1517-HBGA, 42.5 × 42.5 mm) with surface-mount assembly.
- Industrial Temperature Grade Specified operating range from −40 °C to 100 °C for industrial deployment and extended-environment reliability.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- High‑speed Communications and Networking Large logic capacity and extensive I/O make the device suitable for protocol implementation, packet processing, and aggregation functions.
- Industrial Control and Automation Industrial temperature rating and flexible I/O support sensor interfaces, motion control logic, and deterministic control systems.
- Data Acquisition and Test Equipment Embedded memory and high I/O density allow real-time buffering and multi-channel data capture for measurement systems.
- Signal Processing and Acceleration On-chip memory and the Stratix IV E family architecture support DSP blocks and clocking resources referenced in device documentation for processing pipelines and hardware acceleration.
Unique Advantages
- Extensive Logic Resources: With 813,050 logic elements, the EP4SE820H40I3 consolidates large designs that would otherwise require multiple devices, reducing board-level complexity.
- Substantial On‑Chip Memory: Approximately 34 Mbits of embedded RAM lowers dependence on external memory for buffering and intermediate data storage.
- Very High I/O Density: 976 I/Os provide the flexibility to interface with multiple peripherals, memory buses, and high-channel-count front-ends without external multiplexing.
- Industrial‑Grade Operating Range: Rated from −40 °C to 100 °C to meet industrial environmental requirements and ensure consistent operation across a wide temperature span.
- Compact FCBGA Package: 1517-BBGA / 1517-HBGA package format (42.5 × 42.5 mm) enables high integration in space-constrained system designs while supporting surface-mount assembly.
- Controlled Core Voltage: Specified core supply window (870 mV–930 mV) facilitates precise power design and predictable thermal/power management.
Why Choose EP4SE820H40I3?
The EP4SE820H40I3 delivers a combination of high logic density, substantial embedded memory, and very high I/O count in a single industrial-grade FPGA package. Its specification and placement within the Stratix IV E device family make it suited for systems that require integrated processing, buffering, and interface consolidation without fragmenting functionality across multiple components.
Designers and procurement teams seeking a robust, high-capacity FPGA for industrial and data-intensive applications will find the EP4SE820H40I3 appropriate for complex logic implementations, protocol handling, and onboard signal processing, supported by available device documentation for the Stratix IV family.
Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the EP4SE820H40I3. Our team can provide additional technical details and support to help evaluate the device for your design.

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