EP4SE820H40I3

IC FPGA 976 I/O 1517HBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 976 34093056 813050 1517-BBGA, FCBGA

Quantity 270 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O976Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H40I3 – STRATIX® IV E FPGA, 813,050 logic elements, 976 I/Os, 1517-FCBGA

The EP4SE820H40I3 is a STRATIX® IV E Field Programmable Gate Array (FPGA) IC designed for demanding embedded and industrial applications. It provides a high logic capacity FPGA core combined with a large complement of embedded memory and I/O to address high-throughput, protocol-rich designs.

Targeted use cases include high-speed communications, industrial control and automation, and data-handling or signal-processing systems where large logic resources, extensive on-chip memory, and dense I/O packing are required. The device is specified for industrial temperature operation and low-voltage core supply ranges to support robust deployment scenarios.

Key Features

  • Logic Capacity  Provides 813,050 logic elements to implement large, complex logic functions and system-level integration on a single device.
  • Embedded Memory  Approximately 34 Mbits of on-chip RAM (34,093,056 total RAM bits) for buffering, packet processing, and scratchpad memory requirements.
  • High I/O Count  976 I/O pins accommodate dense connectivity for multi-channel interfaces, memory buses, and peripheral integration.
  • Device Family Capabilities  Part of the Stratix IV E device family; device handbook references architecture features such as embedded memory, DSP blocks, PLLs, and high-speed transceiver features for protocol and bandwidth support.
  • Power and Voltage  Core supply specified from 870 mV to 930 mV to match system power-rail requirements and support predictable power budgeting.
  • Package & Mounting  Delivered in a 1517-BBGA FCBGA package (supplier device package listed as 1517-HBGA, 42.5 × 42.5 mm) with surface-mount assembly.
  • Industrial Temperature Grade  Specified operating range from −40 °C to 100 °C for industrial deployment and extended-environment reliability.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • High‑speed Communications and Networking  Large logic capacity and extensive I/O make the device suitable for protocol implementation, packet processing, and aggregation functions.
  • Industrial Control and Automation  Industrial temperature rating and flexible I/O support sensor interfaces, motion control logic, and deterministic control systems.
  • Data Acquisition and Test Equipment  Embedded memory and high I/O density allow real-time buffering and multi-channel data capture for measurement systems.
  • Signal Processing and Acceleration  On-chip memory and the Stratix IV E family architecture support DSP blocks and clocking resources referenced in device documentation for processing pipelines and hardware acceleration.

Unique Advantages

  • Extensive Logic Resources:  With 813,050 logic elements, the EP4SE820H40I3 consolidates large designs that would otherwise require multiple devices, reducing board-level complexity.
  • Substantial On‑Chip Memory:  Approximately 34 Mbits of embedded RAM lowers dependence on external memory for buffering and intermediate data storage.
  • Very High I/O Density:  976 I/Os provide the flexibility to interface with multiple peripherals, memory buses, and high-channel-count front-ends without external multiplexing.
  • Industrial‑Grade Operating Range:  Rated from −40 °C to 100 °C to meet industrial environmental requirements and ensure consistent operation across a wide temperature span.
  • Compact FCBGA Package:  1517-BBGA / 1517-HBGA package format (42.5 × 42.5 mm) enables high integration in space-constrained system designs while supporting surface-mount assembly.
  • Controlled Core Voltage:  Specified core supply window (870 mV–930 mV) facilitates precise power design and predictable thermal/power management.

Why Choose EP4SE820H40I3?

The EP4SE820H40I3 delivers a combination of high logic density, substantial embedded memory, and very high I/O count in a single industrial-grade FPGA package. Its specification and placement within the Stratix IV E device family make it suited for systems that require integrated processing, buffering, and interface consolidation without fragmenting functionality across multiple components.

Designers and procurement teams seeking a robust, high-capacity FPGA for industrial and data-intensive applications will find the EP4SE820H40I3 appropriate for complex logic implementations, protocol handling, and onboard signal processing, supported by available device documentation for the Stratix IV family.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the EP4SE820H40I3. Our team can provide additional technical details and support to help evaluate the device for your design.

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