EP4SE820H40C3N

The EP4SE820H40C3N is a commercial-grade Field Programmable Gate Array (FPGA) from Intel's STRATIX® IV E family. It delivers very high logic capacity and on‑chip memory with a large I/O count in a 1517-BBGA FCBGA package for surface-mount applications.

With 813,050 logic elements, approximately 34 Mbits of embedded RAM and 976 general-purpose I/Os, this device is suited to commercial systems that require high integration density, substantial on‑chip memory and broad I/O connectivity while operating within standard commercial voltage and temperature ranges.

Key Features

• Core Capacity — 813,050 logic elements provide extensive programmable logic resources for large or complex digital designs.
• On‑chip Memory — Approximately 34 Mbits of embedded RAM support data buffering, FIFOs and other memory‑intensive functions without external memory.
• I/O Density — 976 I/Os enable high channel counts and wide parallel interfaces for system-level connectivity.
• Package and Mounting — 1517-BBGA (FCBGA) package, supplier device package listed as 1517-HBGA (42.5 × 42.5 mm), optimized for surface-mount PCB assembly.
• Power Range — Core supply specified from 870 mV to 930 mV, allowing designs to target the device’s required voltage range.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation, suitable for commercial-grade applications.
• Regulatory — RoHS‑compliant.

Typical Applications

• High‑density digital processing — Use the large logic capacity and on‑chip RAM for complex state machines, algorithm acceleration and parallel processing tasks.
• Multi‑lane I/O systems — 976 I/Os support wide parallel interfaces, high channel counts and customizable I/O configurations.
• Memory‑intensive buffering — Embedded RAM provides on‑chip storage for packet buffering, data staging and real‑time data handling.
• Commercial embedded systems — Suited to commercial product designs that require substantial programmable logic and I/O within standard operating conditions.

Unique Advantages

• High logic density: 813,050 logic elements reduce the need for multiple FPGAs in complex designs, simplifying board layout and BOM.
• Significant on‑chip memory: Approximately 34 Mbits of embedded RAM lowers dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 976 I/Os provide flexibility for interfacing to numerous peripherals, sensors and parallel buses without external IO expanders.
• Surface‑mount BBGA package: The 1517-BBGA / 1517-HBGA (42.5 × 42.5 mm) options support compact PCB integration and modern assembly processes.
• Commercial temperature and RoHS compliant: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial deployments.

Why Choose EP4SE820H40C3N?

The EP4SE820H40C3N provides a balance of high logic capacity, substantial embedded memory and broad I/O density in a single commercial‑grade FPGA package. Its specification set makes it a practical choice for designers tackling large-scale programmable logic tasks within standard commercial environmental and power constraints.

This device is well suited to engineering teams and procurement looking for a high‑integration FPGA to consolidate multiple functions onto one chip, reduce board-level complexity and address demanding on‑chip memory and I/O requirements for commercial systems.

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