EP4SE820H40C3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 525 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 976 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820H40C3G – Field Programmable Gate Array (FPGA) IC
The EP4SE820H40C3G is a Stratix IV family FPGA from Intel, delivering a large programmable fabric and on-chip resources for complex digital designs. The device combines the Stratix IV architecture features with a high logic element count and substantial embedded memory to support demanding connectivity and processing tasks.
Targeted at commercial applications, this FPGA provides a balance of logic capacity, memory, and I/O density—making it suitable for designs that require high I/O counts, broad protocol support, and extensive programmable logic while operating within standard commercial temperature and supply ranges.
Key Features
- Core architecture — Stratix IV family: Device handbook references include architecture features such as high-speed transceivers, digital signal processing (DSP) blocks, PLLs, and clock networks for advanced system integration.
- Logic capacity: 813,050 logic elements to implement large-scale logic, custom datapaths, and control logic.
- Embedded memory: Approximately 34 Mbits of on-chip RAM for buffering, frame storage, and local data processing.
- I/O and connectivity: 976 I/O pins to support dense external interfaces and board-level connectivity; device handbook highlights high-speed differential I/O and broad protocol support.
- Package and mounting: 1517-BBGA (FCBGA) package case with supplier device package 1517-HBGA (45×45); surface-mount mounting for PCB integration.
- Power supply: Core voltage supply range of 870 mV to 930 mV.
- Operating conditions and compliance: Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High-speed serial interfaces and protocol bridging: Leverages the Stratix IV high-speed transceiver features and broad protocol support for multi-protocol connectivity and data transport.
- Real-time DSP and signal processing: Uses the large logic fabric and documented DSP block support for filtering, transforms, and real-time processing pipelines.
- External memory interfaces and buffering: Combines embedded memory and the device family’s external memory interface features for high-throughput memory subsystems.
- Data aggregation and switching: High I/O count and clock-network capabilities enable aggregation, packet processing, and timing-sensitive switching functions.
Unique Advantages
- Highly scalable programmable fabric: 813,050 logic elements allow consolidation of multiple functions into a single device, reducing system complexity.
- Substantial on-chip memory: Approximately 34 Mbits of embedded RAM to minimize external memory dependence and accelerate data-path operations.
- Extensive connectivity: 976 I/O pins provide the pin count needed for parallel interfaces, wide buses, and dense peripheral routing.
- Advanced Stratix IV features: Device handbook coverage of high-speed transceivers, DSP blocks, PLLs, and clock networks supports performance-oriented designs and signal integrity strategies.
- Board-ready package: 1517-HBGA (45×45) BGA family package and surface-mount mounting ease integration into compact, high-density PCBs.
- Commercial deployment ready: RoHS compliance and a 0 °C to 85 °C operating range align the device with mainstream commercial product requirements.
Why Choose EP4SE820H40C3G?
EP4SE820H40C3G is positioned for designers who need a large-capacity FPGA with significant on-chip memory and high I/O density, backed by the Stratix IV device family architecture documented in the Intel device handbook. Its combination of logic elements, embedded RAM, and I/O enables consolidation of complex functions and supports high-throughput, timing-sensitive designs.
With commercial temperature range, RoHS compliance, and a compact BGA package, this device fits a wide range of board-level applications where scalability, integration, and the Stratix IV feature set are required.
Request a quote or submit an inquiry for pricing and availability of EP4SE820H40C3G to move your design forward.

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