EP4SE820H35I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 315 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820H35I4G – Field Programmable Gate Array (FPGA) IC
The EP4SE820H35I4G is an Intel Stratix IV family FPGA device providing a high-density, industrial-grade programmable logic platform. It combines a large logic fabric with abundant I/O and embedded memory to support complex digital designs.
Device documentation for the Stratix IV family highlights architecture features such as high-speed transceivers, DSP blocks, PLLs, and external memory interfaces, making this device suitable for applications that require heavy logic, memory, and I/O integration.
Key Features
- Logic Capacity Approximately 813,050 logic elements for implementing large-scale custom logic and control functions.
- Embedded Memory Approximately 34 Mbits of embedded memory to support buffering, FIFOs, and on-chip data storage.
- I/O Resources 744 I/O pins to connect high-density external interfaces and parallel buses.
- High-Speed Architecture Highlights Stratix IV family documentation lists high-speed transceiver support, DSP blocks, PLLs, and external memory interface capabilities.
- Package and Mounting 1152-ball FCBGA / 1152-HBGA supplier package (42.5 × 42.5 mm) in a surface-mount form factor for board-level integration.
- Power Supply Core supply range 870 mV to 930 mV, enabling precise power planning for the FPGA core.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Regulatory RoHS compliant.
Typical Applications
- High-speed communications Leverages Stratix IV high-speed transceiver and protocol support for packet processing, backplane interfaces, and protocol bridging.
- Digital signal processing Large logic and embedded memory capacity combined with DSP resources (per Stratix IV documentation) for real-time signal processing tasks.
- High-density I/O systems 744 I/O pins support complex data acquisition, multi-channel sensor interfaces, and wide parallel buses.
Unique Advantages
- High logic density: Approximately 813,050 logic elements enable consolidation of multiple functions into a single device, reducing overall BOM and board complexity.
- Substantial on-chip memory: Approximately 34 Mbits of embedded memory minimizes external memory dependency for many buffering and data-path needs.
- Robust I/O complement: 744 I/Os provide flexibility for interfacing to a wide range of peripherals and high-bandwidth external devices.
- Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
- Surface-mount BGA package: 1152-ball HBGA/FCBGA package (42.5 × 42.5 mm) enables compact, high-density PCB layouts.
- Standards-aligned documentation: Device details are covered in the Stratix IV Device Handbook, which documents architecture features such as transceivers, PLLs, DSP blocks, and external memory interfaces.
Why Choose EP4SE820H35I4G?
The EP4SE820H35I4G delivers a balanced combination of large logic capacity, significant embedded memory, and extensive I/O in an industrial-grade Stratix IV FPGA device. Its package and power-supply requirements support integration into dense, high-performance systems while the documented architecture features provide the building blocks for high-speed data and signal-processing designs.
This device is suited for design teams needing high-density programmable logic and reliable operation across industrial temperature ranges, with long-term value from a well-documented architecture and RoHS-compliant construction.
Request a quote or submit an inquiry to receive pricing and availability for EP4SE820H35I4G and to discuss your design requirements.

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