EP4SE820H35I3N

The EP4SE820H35I3N is a STRATIX® IV E Field Programmable Gate Array (FPGA) from Intel, provided in a 1152-ball BGA package. It offers a high logic element count and substantial embedded memory capacity, and is specified for industrial-grade temperature and surface-mount assembly.

This device targets designs that require dense programmable logic, abundant I/O, and on-chip memory within an industrial operating range. Core specifications include 813,050 logic elements, approximately 34.09 Mbits of embedded memory, and 744 user I/Os.

Key Features

• Logic Density  Provides 813,050 logic elements suitable for large, complex designs requiring extensive programmable logic resources.
• On-Chip Memory  Approximately 34.09 Mbits of embedded memory (34,093,056 total RAM bits) for buffering, state storage, and local data processing.
• I/O Count  744 user I/Os to support broad peripheral and interface connectivity directly from the FPGA.
• Package and Mounting  Offered in a 1152-ball BGA package (FCBGA); supplier package listed as 1152-HBGA with a 42.5×42.5 mm footprint. Surface-mount mounting type.
• Power  Core supply range specified at 870 mV to 930 mV for compatibility with low-voltage core power domains.
• Temperature Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Device-Level Capabilities  The Stratix IV device handbook includes specifications for PLLs, transceivers, DSP block functionality, TriMatrix memory blocks, and clock-tree elements referenced for this device family.
• Compliance  RoHS-compliant construction.

Typical Applications

• Industrial Control Systems  Programmable logic and large I/O count support complex control, protocol bridging, and interface consolidation within industrial equipment.
• Signal Processing and Acceleration  Substantial logic density and embedded memory accommodate on-chip DSP functions and local buffering for processing tasks.
• High-Density I/O Aggregation  744 I/Os enable consolidation of multiple sensor, actuator, or peripheral interfaces into a single programmable device.

Unique Advantages

• High logic capacity: 813,050 logic elements provide the headroom needed to implement complex state machines, custom processors, and deep datapaths within one device.
• Significant embedded memory: Approximately 34.09 Mbits of on-chip RAM reduces dependence on external memory for many buffering and scratchpad needs.
• Broad I/O availability: 744 user I/Os simplify board-level routing and reduce the need for multiple interface ICs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact BGA packaging: 1152-ball FCBGA / 1152-HBGA (42.5×42.5 mm) provides a dense footprint for space-constrained system designs.
• Documented subsystem specifications: Device handbook coverage of PLLs, transceivers, DSP blocks, and memory blocks helps with detailed design planning and verification.

Why Choose EP4SE820H35I3N?

The EP4SE820H35I3N positions itself as a high-density Stratix IV E FPGA option for industrial applications requiring extensive programmable logic, significant on-chip memory, and a large number of I/Os. Its specified core voltage range and documented device-level resources make it appropriate for designs that consolidate multiple functions into a single FPGA package.

Engineers and system designers seeking a scalable, RoHS-compliant FPGA with comprehensive device handbook coverage for PLLs, transceivers, DSP and memory block specifications will find the EP4SE820H35I3N suited to complex industrial and processing-oriented projects.

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