EP4SE820H35I3G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 431 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-HBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820H35I3G – Field Programmable Gate Array (FPGA) IC
The EP4SE820H35I3G is an Intel (Altera) Stratix IV family FPGA device providing a high-density programmable fabric for complex digital designs. It combines a large number of logic elements, substantial embedded memory, and extensive I/O to address demanding applications in communications, signal processing, and system integration.
Designed for industrial-grade deployments, the device offers a defined core voltage range and wide operating temperature window, enabling reliable operation in controlled and harsh environments where deterministic performance and integration density are required.
Key Features
- High-density logic fabric — 813,050 logic elements for implementing large-scale digital designs and complex logic architectures.
- Embedded memory — Approximately 34 Mbits of on-chip RAM for buffering, lookup tables, and state storage close to the logic fabric.
- Extensive I/O — 744 user I/O pins to support broad external connectivity and parallel interfaces.
- Package and mounting — Available in a 1152-ball FCBGA/HBGA package (1152-HBGA, 42.5×42.5 mm) suited for surface-mount PCB assembly.
- Industrial temperature grade — Specified operating temperature from −40 °C to 100 °C to meet industrial application requirements.
- Core voltage — Core supply range specified between 870 mV and 930 mV to match system power-rail design.
- Stratix IV architecture details — Datasheet handbooks for the Stratix IV family document architecture features such as embedded memory, DSP blocks, clock networks, PLLs, and high-speed transceiver and I/O capabilities.
- Compliance — RoHS compliant for regulatory and environmental considerations.
Typical Applications
- High-speed communications — Use the Stratix IV architecture and extensive I/O to implement protocol processing, data aggregation, and custom transceiver interfacing.
- Digital signal processing — Large logic element count and documented DSP block resources make the device suitable for hardware acceleration of signal-processing algorithms.
- External memory interfaces — On-chip resources and Stratix IV external memory interface support allow designers to build controllers and buffering systems for high-bandwidth memory connections.
- System integration and prototyping — Dense logic, embedded RAM, and abundant I/O simplify integration of custom control, glue logic, and system-level prototyping.
Unique Advantages
- Highly integrated programmable fabric: 813,050 logic elements with approximately 34 Mbits of embedded memory reduce the need for external logic and memory components.
- Wide connectivity options: 744 I/O pins provide flexibility to interface with a broad range of peripherals and high-pin-count systems.
- Industrial reliability: Specified for −40 °C to 100 °C operation to support hardware deployed in industrial environments.
- Compact, high-density packaging: 1152-ball HBGA package (42.5 × 42.5 mm) enables high pin-count in a compact footprint for dense board designs.
- Defined power envelope: Core supply specified at 870–930 mV to help with power budgeting and supply design in system implementations.
- Standards-aware architecture: Stratix IV family documentation highlights support for high-speed transceivers, PLLs, clock networks, and external memory interfaces for system-level design needs.
Why Choose EP4SE820H35I3G?
The EP4SE820H35I3G delivers a high-density Stratix IV FPGA option for designs that require substantial logic capacity, embedded memory, and broad I/O capability in an industrial-grade package. Its documented architecture features—such as DSP blocks, clocking resources, and high-speed I/O—help teams consolidate functions into a single programmable device.
This device is suited for engineering teams developing complex communications, signal-processing, or system-integration solutions that need a combination of performance, integration density, and defined environmental specifications backed by Stratix IV family documentation from Intel/Altera.
Request a quote or submit an inquiry to purchase EP4SE820H35I3G and discuss availability, lead times, and volume pricing with the supplier.

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