EP4SE820H35I3G

IC FPGA 744 I/O 1152HBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 431 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1152-HBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820H35I3G – Field Programmable Gate Array (FPGA) IC

The EP4SE820H35I3G is an Intel (Altera) Stratix IV family FPGA device providing a high-density programmable fabric for complex digital designs. It combines a large number of logic elements, substantial embedded memory, and extensive I/O to address demanding applications in communications, signal processing, and system integration.

Designed for industrial-grade deployments, the device offers a defined core voltage range and wide operating temperature window, enabling reliable operation in controlled and harsh environments where deterministic performance and integration density are required.

Key Features

  • High-density logic fabric — 813,050 logic elements for implementing large-scale digital designs and complex logic architectures.
  • Embedded memory — Approximately 34 Mbits of on-chip RAM for buffering, lookup tables, and state storage close to the logic fabric.
  • Extensive I/O — 744 user I/O pins to support broad external connectivity and parallel interfaces.
  • Package and mounting — Available in a 1152-ball FCBGA/HBGA package (1152-HBGA, 42.5×42.5 mm) suited for surface-mount PCB assembly.
  • Industrial temperature grade — Specified operating temperature from −40 °C to 100 °C to meet industrial application requirements.
  • Core voltage — Core supply range specified between 870 mV and 930 mV to match system power-rail design.
  • Stratix IV architecture details — Datasheet handbooks for the Stratix IV family document architecture features such as embedded memory, DSP blocks, clock networks, PLLs, and high-speed transceiver and I/O capabilities.
  • Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

  • High-speed communications — Use the Stratix IV architecture and extensive I/O to implement protocol processing, data aggregation, and custom transceiver interfacing.
  • Digital signal processing — Large logic element count and documented DSP block resources make the device suitable for hardware acceleration of signal-processing algorithms.
  • External memory interfaces — On-chip resources and Stratix IV external memory interface support allow designers to build controllers and buffering systems for high-bandwidth memory connections.
  • System integration and prototyping — Dense logic, embedded RAM, and abundant I/O simplify integration of custom control, glue logic, and system-level prototyping.

Unique Advantages

  • Highly integrated programmable fabric: 813,050 logic elements with approximately 34 Mbits of embedded memory reduce the need for external logic and memory components.
  • Wide connectivity options: 744 I/O pins provide flexibility to interface with a broad range of peripherals and high-pin-count systems.
  • Industrial reliability: Specified for −40 °C to 100 °C operation to support hardware deployed in industrial environments.
  • Compact, high-density packaging: 1152-ball HBGA package (42.5 × 42.5 mm) enables high pin-count in a compact footprint for dense board designs.
  • Defined power envelope: Core supply specified at 870–930 mV to help with power budgeting and supply design in system implementations.
  • Standards-aware architecture: Stratix IV family documentation highlights support for high-speed transceivers, PLLs, clock networks, and external memory interfaces for system-level design needs.

Why Choose EP4SE820H35I3G?

The EP4SE820H35I3G delivers a high-density Stratix IV FPGA option for designs that require substantial logic capacity, embedded memory, and broad I/O capability in an industrial-grade package. Its documented architecture features—such as DSP blocks, clocking resources, and high-speed I/O—help teams consolidate functions into a single programmable device.

This device is suited for engineering teams developing complex communications, signal-processing, or system-integration solutions that need a combination of performance, integration density, and defined environmental specifications backed by Stratix IV family documentation from Intel/Altera.

Request a quote or submit an inquiry to purchase EP4SE820H35I3G and discuss availability, lead times, and volume pricing with the supplier.

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