EP4SE820H35C4

The EP4SE820H35C4 is a STRATIX® IV E field programmable gate array (FPGA) IC from Intel, provided in a 1152‑ball BGA package. It combines very high logic capacity with substantial on‑chip RAM and a large I/O count to address complex, high‑density digital designs.

Designed for commercial‑grade applications, the device supports surface‑mount assembly and operates from a core supply range of 870 mV to 930 mV with an ambient temperature range of 0 °C to 85 °C. It is RoHS‑compliant.

Key Features

• Core Architecture STRATIX IV E FPGA family device offering high integration for complex logic implementations.
• Logic Capacity 813,050 logic elements providing large-scale programmable fabric for extensive custom logic and control functions; 32,522 logic blocks for resource partitioning.
• Embedded Memory Approximately 34.09 Mbits of on‑chip RAM to support large buffering, state machines, and data processing tasks without external memory.
• I/O Integration 744 user I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high‑pin‑count connectivity.
• Power Core voltage supply range of 870 mV to 930 mV to match system power rails and enable deterministic core operation.
• Package & Mounting Surface‑mount 1152‑BBGA (FCBGA) offering a compact footprint; supplier package specified as 1152‑HBGA (42.5 × 42.5 mm).
• Operating Conditions & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance RoHS‑compliant for adherence to common environmental regulations.

Typical Applications

• High‑density digital systems — Suited for designs that require extensive programmable logic and memory capacity, enabled by 813,050 logic elements and approximately 34.09 Mbits of embedded RAM.
• Multi‑interface aggregation — With 744 I/O pins, the device supports integration of numerous parallel interfaces and peripheral connections on a single FPGA.
• System integration and prototyping — Large logic and memory resources allow consolidation of multiple subsystems into one FPGA for development and validation.

Unique Advantages

• High logic density: 813,050 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 34.09 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O capability: 744 I/O pins provide flexibility to connect many peripherals and wide data buses directly to the FPGA.
• Compact, manufacturable package: 1152‑BBGA (1152‑HBGA supplier package, 42.5 × 42.5 mm) supports high‑density PCB layouts and surface‑mount assembly processes.
• Commercial suitability and compliance: Operates across 0 °C to 85 °C and is RoHS‑compliant for standard commercial deployments.

Why Choose EP4SE820H35C4?

The EP4SE820H35C4 targets designs that demand very large programmable logic resources, significant embedded memory, and broad I/O connectivity within a single, surface‑mount FPGA package. Its combination of 813,050 logic elements, approximately 34.09 Mbits of on‑chip RAM, and 744 I/Os positions it for consolidation of complex digital functions into one device while meeting commercial temperature and environmental requirements.

For engineering teams and procurement organizations needing a high‑capacity STRATIX IV E FPGA in a 1152‑BBGA form factor with RoHS compliance, this part provides clear, verifiable specifications for system sizing and integration.

Request a quote or submit your procurement inquiry to receive pricing and availability information for the EP4SE820H35C4.