EP4SE820H35C3N

The EP4SE820H35C3N is a Stratix IV E field-programmable gate array from Intel, supplied in a 1152-ball BGA package. It delivers a large programmable fabric paired with significant on-chip RAM and a high I/O count for complex system designs.

With 813,050 logic elements, approximately 34 Mbits of embedded memory and 744 I/Os, this commercial-grade, surface-mount FPGA is aimed at designs that require extensive logic capacity, substantial on-chip buffering and dense external connectivity while operating within a 0 °C to 85 °C range.

Key Features

• High-density Logic Fabric 813,050 logic elements provide a large programmable resource for complex logic, custom accelerators and system integration tasks.
• Embedded Memory Approximately 34 Mbits of on-chip RAM support substantial buffering, state storage and memory-intensive functions without relying solely on external memory.
• Extensive I/O 744 available I/Os enable high device-to-board connectivity for parallel interfaces, bus bridging and dense peripheral attachment.
• Stratix IV E Family Capabilities As part of the Stratix IV device family, the device is documented alongside architecture features such as embedded memory, DSP blocks, PLLs and advanced I/O capabilities referenced in the device handbook.
• Package and Mounting 1152-ball BGA (FCBGA) packaging with supplier package reference 1152-HBGA (42.5 × 42.5 mm) and surface-mount construction for compact board integration.
• Low-Voltage Core Supply Core supply range of 870 mV to 930 mV supports the device’s internal power requirements and system power budgeting.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
• RoHS Compliant Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• High-density digital processing — Large logic fabric and extensive embedded RAM enable complex custom datapaths, parallel processing and hardware acceleration.
• High-pin-count interface control — 744 I/Os provide the connectivity needed for multi-channel interfaces, bus converters and I/O-heavy controllers.
• On-chip buffering and memory functions — Approximately 34 Mbits of embedded RAM support packet buffering, FIFO staging and state storage for data-flow designs.
• System integration and prototyping — The Stratix IV E device family documentation supports integration of DSP, PLL and I/O features into system prototypes and production designs.

Unique Advantages

• Large programmable capacity: 813,050 logic elements reduce the need for multi-device solutions by consolidating complex logic into a single FPGA.
• Substantial on-chip memory: Approximately 34 Mbits of embedded RAM lowers dependence on external memory for buffering and accelerates data-path performance.
• High connectivity: 744 I/Os enable dense peripheral and parallel interface implementations without multiple I/O expanders.
• Compact BGA footprint: 1152-ball FCBGA (42.5 × 42.5 mm supplier reference) supports high-density board layouts while maintaining surface-mount assembly.
• Power domain clarity: Defined core voltage range (870 mV–930 mV) helps planners align power-supply design with FPGA requirements.
• Standards-conscious supply chain: RoHS compliance supports lead-free manufacturing and regulatory alignment.

Why Choose EP4SE820H35C3N?

The EP4SE820H35C3N combines a very large logic element count with substantial embedded memory and a high I/O count in a compact BGA package, making it suitable for designs that demand integration of complex logic, buffering and dense external connectivity. Its commercial temperature rating and defined core-voltage range simplify system-level planning for mainstream electronics applications.

As a member of the Stratix IV E family, this device is documented within Intel's device handbook that outlines architecture features such as embedded memory, DSP resources and advanced I/O capabilities, providing engineers with technical reference material to support design and integration work.

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