EP4SE820H35C3G

The EP4SE820H35C3G is a high-density FPGA from the Stratix IV family, designed for complex logic and system integration tasks. It combines a large logic fabric with substantial embedded memory and extensive I/O to address demanding applications that require high logic capacity, on-chip storage, and broad interfacing.

Targeted at commercial deployments, this device is suitable for applications that leverage the Stratix IV architecture features documented in the device handbook, including DSP blocks, advanced clocking and PLLs, high-speed I/O and flexible external memory interfaces.

Key Features

• Logic resources — Approximately 813,050 logic elements and 32,522 LABs provide the capacity for complex, multi-function designs.
• Embedded memory — Approximately 34 Mbits of embedded memory (34,093,056 total RAM bits) for buffering, FIFOs and on-chip data storage.
• I/O and interfacing — 744 I/O pins to support extensive external connectivity; the Stratix IV family includes high-speed differential I/O and external memory interface support as described in the device handbook.
• Package and mounting — 1152-ball FCBGA package (supplier package: 1152-HBGA, 42.5 × 42.5 mm) in a surface-mount form factor for high-pin-count board integration.
• Power — Core voltage supply range of 870 mV to 930 mV to match the device power architecture.
• Operating conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
• Stratix IV architecture features — Series documentation highlights embedded DSP blocks, clock networks, PLLs, diagnostics and signal-integrity features useful for high-bandwidth designs.

Typical Applications

• High-performance signal processing — Use the large logic fabric and embedded memory for FPGA-based DSP, filtering and algorithm acceleration.
• Networking and telecom equipment — Leverage the Stratix IV family’s high-speed I/O and protocol support for packet processing, line cards and aggregation tasks.
• Memory interface controllers — Implement external memory controllers and high-bandwidth interfaces using the device’s I/O capacity and on-chip RAM.
• Custom prototyping and system integration — Deploy as a high-capacity prototyping platform or as a replacement for complex ASIC functions requiring extensive logic and I/O.

Unique Advantages

• High logic density: 813,050 logic elements enable consolidation of complex functions into a single device, reducing system-level component count.
• Substantial on-chip memory: Approximately 34 Mbits of embedded RAM minimize dependence on external memory for many buffering and storage needs.
• Broad I/O capability: 744 I/O pins provide flexibility to connect multiple peripherals, memory devices and transceivers.
• Compact, high-pin-count package: The 1152-ball FCBGA (42.5 × 42.5 mm) balances density and routability for compact system designs.
• Controlled core power: 870–930 mV core supply range aligns with the device power architecture for predictable power budgeting.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose EP4SE820H35C3G?

The EP4SE820H35C3G positions itself as a high-capacity, commercially graded FPGA offering from the Stratix IV family, combining extensive logic resources, significant on-chip memory and a large number of I/O in a single surface-mount FCBGA package. These attributes make it well suited for designs that require high integration density and flexible interfacing.

Supported by the Stratix IV device handbook documentation, the device is aimed at engineers building high-bandwidth, high-density solutions where on-chip resources and packaged pin-count are critical. It offers a clear path for scalable, robust designs that leverage the documented architecture features of the Stratix IV family.

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