EP4SE820F43I4
| Part Description |
STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1120 34093056 813050 1760-BBGA, FCBGA |
|---|---|
| Quantity | 51 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 1120 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32522 | Number of Logic Elements/Cells | 813050 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 34093056 |
Overview of EP4SE820F43I4 – STRATIX® IV E FPGA, Industrial 1760-FCBGA
The EP4SE820F43I4 is a Stratix IV E field‑programmable gate array (FPGA) IC from Intel (Altera) designed for high‑density, system‑level integration. It implements the Stratix IV E device core and fabric to deliver a large logic capacity together with substantial on‑chip memory and extensive I/O.
Targeted at applications that require high aggregate data bandwidth, complex signal processing, and dense logic integration, this industrial‑grade device combines more than 813,000 logic elements, approximately 34 Mbits of embedded memory, and 1,120 I/Os in a 1760‑ball FCBGA package.
Key Features
- Core Architecture Stratix IV E family device architecture as documented in the Stratix IV Device Handbook; built for system integration and high bandwidth applications.
- Logic Capacity 813,050 logic elements and 32,522 logic array blocks, enabling large, complex designs and extensive custom logic implementation.
- Embedded Memory Approximately 34 Mbits of on‑chip RAM to support buffering, packet processing, and DSP data storage needs.
- I/O and Interfaces 1,120 user I/Os to support dense peripheral connectivity and wide external interface options.
- Power and Supply Core voltage supply range specified at 870 mV to 930 mV for compatibility with low‑voltage system rails.
- Package and Mounting 1760‑ball FCBGA (1760‑FCBGA 42.5 × 42.5 mm), surface‑mount package optimized for high‑density board layouts.
- Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant.
Typical Applications
- High‑performance networking and communications — Large I/O count and substantial on‑chip memory support packet processing, protocol handling, and high aggregate bandwidth functions.
- DSP and signal processing — Significant logic element count and embedded RAM enable complex, real‑time signal processing pipelines and algorithm implementation.
- System integration and prototyping — Dense logic and I/O resources provide a platform for integrating multiple subsystems and validating hardware architectures.
- Industrial control and automation — Industrial temperature rating and broad I/O support suit demanding control and automation environments requiring reliable operation across temperature extremes.
Unique Advantages
- High logic density: 813,050 logic elements allow implementation of large, feature‑rich designs without external logic expansion.
- Substantial on‑chip memory: Approximately 34 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
- Extensive I/O capability: 1,120 user I/Os provide the flexibility to connect numerous peripherals and high‑speed interfaces directly to the FPGA.
- Industrial temperature range: Rated for −40 °C to 100 °C to support deployment in harsh or temperature‑variable environments.
- Compact, high‑density package: 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package balances board space with connectivity and thermal considerations.
- Part of a documented device family: Belongs to the Stratix IV device family with published device handbook and technical documentation for system designers.
Why Choose EP4SE820F43I4?
The EP4SE820F43I4 is positioned for projects that require large logic capacity, extensive I/O, and significant on‑chip memory within an industrial‑rated package. Its combination of 813,050 logic elements, approximately 34 Mbits of embedded RAM, and 1,120 I/Os makes it suitable for complex networking, signal processing, and system integration tasks where board‑level consolidation is a priority.
Designers and procurement teams seeking a Stratix IV E FPGA with documented family support, a low‑voltage core supply range, and a rugged operating temperature window will find this device aligned with long‑term scalability and reliability objectives.
Request a quote or submit an inquiry to receive pricing, availability, and ordering details for EP4SE820F43I4.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018