EP4SE820F43C4N

IC FPGA 1120 I/O 1760FBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1120 34093056 813050 1760-BBGA, FCBGA

Quantity 350 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O1120Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820F43C4N – STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1760-FCBGA

The EP4SE820F43C4N is a Stratix IV E family FPGA in a 1760-ball FCBGA package, designed for high-density, programmable logic applications. It combines a large logic fabric with substantial on-chip RAM and extensive I/O to support compute- and data-intensive designs in commercial-grade systems.

Targeted at applications that require significant logic resources, embedded memory and flexible I/O, this device delivers a balance of integration and system-level capability while operating within a low-voltage supply range and a commercial temperature envelope.

Key Features

  • Core Logic  Approximately 813,050 logic elements (cells) provide a large programmable fabric for complex logic, control and datapath functions.
  • Embedded Memory  Approximately 34 Mbits of embedded memory (34,093,056 total RAM bits) for on-chip buffering, FIFOs and storage.
  • I/O Capacity  Up to 1,120 general-purpose I/Os to support wide parallel interfaces and mixed-signal routing on system boards.
  • Package & Mounting  1760-FCBGA package (42.5×42.5 mm) with surface-mount mounting for high-density PCB integration.
  • Power  Low-voltage core supply range from 870 mV to 930 mV to match stringent power-rail designs.
  • Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS-compliant construction.
  • Device Family Capabilities  Stratix IV E family features from the datasheet—such as architecture enhancements, DSP blocks, PLLs, clock networks, and high-speed I/O features—support system-level integration and high aggregate bandwidth designs.

Typical Applications

  • High-bandwidth Networking  Use the large logic and I/O count for packet processing, switching, and line-card functions that demand parallel interfaces and sizeable on-chip buffering.
  • Signal Processing & Accelerators  Leverage the device family’s DSP and embedded memory resources for real-time filtering, transforms and custom accelerator pipelines.
  • External Memory Interfaces  Implement high-throughput memory controllers and bridge logic using the available on-chip RAM and I/O to connect external DRAM and peripherals.
  • Video & Imaging Systems  Deploy the device for frame buffering, image pipelines and interface conversion where large logic capacity and memory are required.

Unique Advantages

  • High Logic Density:  Approximately 813,050 logic elements enable complex, integrated designs that reduce the need for multiple discrete devices.
  • Substantial Embedded Memory:  Around 34 Mbits of on-chip RAM supports buffering and local data storage to improve system throughput and latency.
  • Extensive I/O Count:  1,120 I/Os provide flexibility for parallel buses, wide external interfaces and mixed-signal board routing.
  • Compact, High-Density Package:  1760-FCBGA (42.5×42.5 mm) balances pin count and PCB area for dense system layouts.
  • Low-Voltage Core Operation:  870 mV–930 mV supply range aligns with modern low-power power-rail architectures.
  • Commercial-Grade & RoHS Compliant:  Designed for commercial temperature environments and regulatory compliance for lead-free assembly.

Why Choose EP4SE820F43C4N?

The EP4SE820F43C4N places a high-density Stratix IV E FPGA into a compact FCBGA package, delivering a large logic fabric, substantial embedded memory and broad I/O capability for demanding commercial applications. This combination makes it suitable for designs that require significant on-chip resources and flexible interfacing while staying within a commercial operating temperature range.

For engineering teams building high-throughput networking, signal processing, memory-interface or imaging systems, the device offers a balanced platform—scalable logic, embedded RAM and device-family architectural features—to simplify system integration and support advanced design requirements.

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