EP4SE820F43I3

The EP4SE820F43I3 is a STRATIX® IV E field programmable gate array (FPGA) from Intel, offered in a 1760-ball FCBGA package for surface-mount assembly. It delivers very high logic capacity and significant on-chip memory, combined with a large I/O count and an industrial temperature rating.

With 813,050 logic elements and approximately 34 Mbits of embedded RAM, this device suits designs that require dense programmable logic, substantial embedded memory, and extensive external connectivity while operating across an industrial temperature range.

Key Features

• Core Logic  813,050 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 34 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• I/O Capacity  1,120 I/Os to support high-pin-count interfaces and multiple external peripherals or bus connections.
• Power  Core supply voltage specified from 870 mV to 930 mV, enabling integration with low-voltage system power rails.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) package, surface-mount for compact board-level integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• Environmental Compliance  RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Complex Digital Processing  Use the large logic capacity and embedded RAM for compute-intensive FPGA functions such as custom accelerators or signal processing blocks.
• Memory-Intensive Designs  Approximately 34 Mbits of on-chip RAM enables buffering, packet queuing, and state storage for data-centric architectures.
• I/O-Heavy Systems  High I/O count supports multi-protocol interfaces, high-channel-count data acquisition, and dense connector-based systems.
• Industrial Control and Automation  Industrial-grade temperature range and robust packaging make the device suitable for factory automation, motion control, and process control applications.

Unique Advantages

• High Logic Density: 813,050 logic elements allow implementation of large, integrated digital systems on a single FPGA, reducing board-level complexity.
• Substantial On-Chip RAM: Approximately 34 Mbits of embedded memory supports local data handling and reduces external memory dependency.
• Extensive Connectivity: 1,120 I/Os enable consolidation of interfaces and simplify routing for complex systems.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments without additional thermal qualification.
• Compact FCBGA Packaging: The 1760-FCBGA (42.5 × 42.5 mm) format balances high pin count with a compact footprint for dense PCB designs.
• RoHS Compliance: Environmentally compliant manufacturing compatibility for regulatory-aligned product development.

Why Choose EP4SE820F43I3?

The EP4SE820F43I3 positions itself as a high-capacity, industrial-grade FPGA option for designers needing large programmable logic resources, significant embedded memory, and a very high I/O count in a single device. Its combination of 813,050 logic elements, approximately 34 Mbits of on-chip RAM, and broad operating temperature range supports robust, long-lived designs.

This device is suited to development teams building complex digital systems, memory-intensive architectures, or I/O-rich platforms that require scalable logic integration and industrial reliability. Choosing the EP4SE820F43I3 helps consolidate functionality, reduce external component count, and maintain operation across demanding temperature conditions.

Request a quote or submit a quote request today to evaluate EP4SE820F43I3 for your next high-density, industrial FPGA design.