EP4SE820F43I3N

IC FPGA 1120 I/O 1760FCBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1120 34093056 813050 1760-BBGA, FCBGA

Quantity 1,073 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O1120Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820F43I3N – STRATIX® IV E FPGA (1760-FCBGA)

The EP4SE820F43I3N is a Stratix IV E field-programmable gate array (FPGA) supplied in a 1760-FCBGA surface-mount package (42.5×42.5 mm). It combines high logic density and extensive I/O with industrial-grade operating range for demanding embedded and communications designs.

With 813,050 logic elements, approximately 34 Mbits of embedded memory and 1,120 I/O pins, this device targets high‑capacity digital implementations that require on‑chip memory, flexible I/O, and the functional building blocks described for the Stratix IV device family (embedded memory, DSP blocks, PLLs, clock networks and high‑speed transceiver support).

Key Features

  • Core Capacity — 813,050 logic elements provide a large programmable fabric for complex logic, control and datapath implementations.
  • On‑Chip Memory — Approximately 34 Mbits of embedded memory enable efficient buffering, packet processing and large on‑chip data structures without immediate dependence on external memory.
  • I/O Density — 1,120 general-purpose I/O pins support wide parallel interfaces and high pin-count peripherals for system integration.
  • Family-Level Architecture — Stratix IV E device family features such as DSP blocks, PLLs, clock networks and high‑speed transceiver support provide the architectural building blocks needed for signal processing and protocol implementations.
  • Power Supply — Core supply specified at 870 mV to 930 mV for deterministic power design and voltage planning.
  • Package & Mounting — 1760‑FCBGA / 1760‑BBGA packaging in a 42.5×42.5 mm footprint with surface‑mount assembly.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial applications requiring extended temperature tolerance.
  • Compliance — RoHS‑compliant manufacturing status for environmental and regulatory considerations.

Typical Applications

  • High‑Performance Signal Processing — Large logic capacity and embedded memory support complex DSP pipelines and real‑time data manipulation.
  • Network & Communication Systems — Extensive I/O and the Stratix IV family’s transceiver and protocol feature set enable packet processing, switching and interface bridging.
  • Data Acquisition & Instrumentation — On‑chip memory and dense logic allow deterministic capture, buffering and preprocessing of high‑channel sensor data.
  • Industrial Control — Industrial temperature rating and high I/O count suit motor control, PLC interfacing and machine‑automation applications requiring robust operation.

Unique Advantages

  • High Logic Density: 813,050 logic elements reduce the need for multiple devices, simplifying board design and lowering interconnect complexity.
  • Substantial On‑Chip Memory: Approximately 34 Mbits of embedded RAM lets designers keep large working sets on‑chip for lower latency and improved throughput.
  • Extensive I/O Count: 1,120 I/O pins enable broad peripheral connectivity and parallel interface implementations without external expanders.
  • Industrial Reliability: −40 °C to 100 °C operating range supports deployment in harsh or temperature‑variable environments.
  • System Integration Friendly: Surface‑mount 1760‑FCBGA package with a 42.5×42.5 mm footprint balances board space and thermal/mechanical considerations for dense system designs.
  • Design Ecosystem Alignment: Leveraging documented Stratix IV family features (PLLs, clock networks, DSP blocks, transceiver support) helps accelerate implementation of protocol and signal‑processing functions.

Why Choose EP4SE820F43I3N?

The EP4SE820F43I3N positions itself for designs that require substantial programmable logic, abundant on‑chip memory and high I/O density within an industrial temperature envelope. Its Stratix IV E architecture elements provide the fundamental building blocks—memory, DSP resources, clocking and transceiver capability—needed for high‑throughput, feature‑rich systems.

This device is well suited to engineering teams building complex communications, signal processing, industrial control or data acquisition products that prioritize integration, predictable power design and extended temperature operation. The combination of capacity and family features offers scalability and long‑term applicability across multiple system generations.

Request a quote or submit a request for pricing and availability to begin evaluating the EP4SE820F43I3N for your next design project.

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