EP4SE820F43C4

The EP4SE820F43C4 is a STRATIX® IV E field-programmable gate array in a 1760-pin FCBGA package designed for high-density, programmable digital logic implementations. With a large logic capacity, substantial embedded memory, and an extensive I/O count, this commercial-grade FPGA targets complex digital processing, system integration, and high-pin-count interface applications where integration and flexibility are required.

Key Features

• Core Logic Provides 813,050 logic elements for implementing large-scale digital designs and complex processing pipelines.
• Embedded Memory Includes approximately 34 Mbits of on-chip RAM to support buffering, lookup tables, and local storage for data-intensive tasks.
• I/O Density Offers 1,120 I/O pins to support wide parallel interfaces, multi-channel connectivity, and high-pin-count system interconnects.
• Package Supplied in a 1760-FCBGA (42.5 × 42.5 mm) ball-grid array package optimized for surface-mount assembly and compact system layouts.
• Power Operates with a core supply voltage range of 870 mV to 930 mV, enabling defined low-voltage system integration.
• Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C and supplied as a surface-mount component.
• Standards RoHS compliant for environmentally conscious product designs.

Typical Applications

• High-density digital signal processing — Leverage the large logic element count and on-chip RAM for complex signal processing and algorithm acceleration.
• Prototyping and system integration — Use the programmable fabric and high I/O count to prototype SoC functions, glue logic, and custom interfaces.
• High-pin-count interface bridging — The 1,120 I/Os enable implementation of wide parallel buses and multi-channel connectivity between system components.

Unique Advantages

• High logic capacity: 813,050 logic elements support large and complex design implementations without external glue logic.
• Substantial embedded memory: Approximately 34 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O resources: 1,120 I/Os accommodate broad connectivity and enable flexible interfacing to peripherals and high-speed links.
• Compact FCBGA packaging: The 1760-FCBGA (42.5 × 42.5 mm) package delivers a high pin count in a footprint suitable for dense board designs.
• Low-voltage core operation: Defined 870 mV–930 mV supply range supports integration into systems using low-voltage power rails.
• RoHS compliant: Meets environmental compliance requirements for modern electronics assemblies.

Why Choose EP4SE820F43C4?

The EP4SE820F43C4 combines very large logic capacity, substantial embedded memory, and an extensive I/O complement in a single FCBGA package, making it well suited for complex digital designs that require high integration density. Its commercial temperature rating and surface-mount FCBGA package support compact system implementations where board space and I/O density are priorities.

For designs that demand scalable programmable logic, significant on-chip RAM, and broad interface capability, the EP4SE820F43C4 provides a balanced platform for development and production with RoHS-compliant manufacturing in mind.

Request a quote or submit a purchase inquiry to evaluate EP4SE820F43C4 for your next high-density FPGA design.