EP4SE820F43C3N

IC FPGA 1120 I/O 1760FCBGA
Part Description

STRATIX® IV E Field Programmable Gate Array (FPGA) IC 1120 34093056 813050 1760-BBGA, FCBGA

Quantity 874 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O1120Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32522Number of Logic Elements/Cells813050
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits34093056

Overview of EP4SE820F43C3N – STRATIX® IV E FPGA, 813,050 logic elements

The EP4SE820F43C3N is a Stratix IV E field programmable gate array (FPGA) in a 1760-FCBGA package. It delivers a high-density programmable fabric with a large embedded memory footprint and extensive I/O, tailored for high-bandwidth digital designs.

This commercial-grade device provides 813,050 logic elements, approximately 34 Mbits of embedded memory, and 1,120 I/Os, offering integration and architectural capacity for demanding communications, signal processing, and system-integration applications.

Key Features

  • Programmable Fabric  813,050 logic elements provide substantial capacity for complex logic, custom processors, and high-density glue logic.
  • Embedded Memory  Approximately 34 Mbits of on-chip RAM supports large buffering, packet handling, and data staging without relying solely on external memory.
  • I/O Density  1,120 available I/Os enable broad external interfacing options for parallel buses, memory interfaces, and multi-protocol connectivity.
  • Power Supply Range  Specified core voltage range of 870 mV to 930 mV to match system power-rail constraints and regulator selection.
  • Package & Mounting  1760-FCBGA (42.5×42.5 mm) surface-mount package provides a compact, high-pin-count solution for board-level integration.
  • Operating Conditions  Commercial-grade operation from 0 °C to 85 °C and RoHS compliance for environmental regulatory alignment.
  • Architecture References  Stratix IV E device family architecture includes features such as high-speed transceiver support, DSP blocks, and external memory interfaces as documented in the device handbook.

Typical Applications

  • Communications Infrastructure  High logic count and extensive I/O make the device suitable for line cards, switches, and other networking equipment requiring flexible protocol handling and aggregation.
  • High-Bandwidth Signal Processing  Large embedded memory and the Stratix IV E architecture support DSP functions and buffering required in video processing and real-time data streams.
  • Compute Acceleration and Custom Engines  Significant programmable fabric capacity enables hardware acceleration blocks, packet processing, and custom compute pipelines.
  • System Integration and Prototyping  High I/O count and dense logic resources provide a platform for consolidating multiple functions and validating complex system-level designs.

Unique Advantages

  • High Fabric Capacity:  813,050 logic elements provide the headroom for complex implementations and multi-function integration.
  • Substantial On-Chip Memory:  Approximately 34 Mbits of embedded RAM reduces dependency on external memory for many buffering and staging use cases.
  • Extensive I/O Count:  1,120 I/Os support high-density external interfacing for parallel buses, wide memory interfaces, and multi-protocol connectivity.
  • Compact High-Pin Package:  1760-FCBGA (42.5×42.5 mm) brings large pin-count capability to a surface-mount package suitable for dense PCB designs.
  • Commercial Temperature and RoHS Compliance:  0 °C to 85 °C rating and RoHS compliance align the device with common commercial deployment requirements.
  • Documented Stratix IV E Architecture:  Device handbook references available architecture features such as high-speed transceivers, DSP blocks, and external memory interfaces for system-level planning.

Why Choose EP4SE820F43C3N?

The EP4SE820F43C3N combines a very large programmable fabric with significant embedded memory and high I/O density in a single commercial-grade FCBGA package. It is positioned for projects that require substantial logic resources, on-chip buffering, and broad external interfacing while maintaining a compact board footprint.

This device suits engineering teams building high-bandwidth communications gear, signal-processing engines, or integrated system prototypes that benefit from the Stratix IV E device family architecture and documented feature set.

Request a quote or submit an inquiry to learn more about availability, lead times, and volume pricing for EP4SE820F43C3N. Our team can provide technical details and support for your design planning and procurement.

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